Abstract: The present disclosure provides a microelectronic isolation system comprising a base, vibration isolator, primary sensor, and microprocessor. The base supports the vibration isolator, the primary sensor, and the microprocessor. The vibration isolator has a platform, isolation material, and at least one isolation sensor. The isolation material dampens an overall vibrational frequency experienced by the microelectronic isolation system. The isolation sensor measures a displacement. The displacement is a measurement of a displacement of the platform with respect to the base. The primary sensor measures a primary sensor response, which is received by the microprocessor to calculate a plurality of responses. The plurality of responses of the microprocessor being one or a combination of a measured compensation response, an inertial response, and a restored primary sensor response.

Abstract: The present disclosure provides a microelectronic isolation system comprising a base, vibration isolator, primary sensor, and microprocessor. The base supports the vibration isolator, the primary sensor, and the microprocessor. The vibration isolator has a platform, isolation material, and at least one isolation sensor. The isolation material dampens an overall vibrational frequency experienced by the microelectronic isolation system. The isolation sensor measures a displacement. The displacement is a measurement of a displacement of the platform with respect to the base. The primary sensor measures a primary sensor response, which is received by the microprocessor to calculate a plurality of responses. The plurality of responses of the microprocessor being one or a combination of a measured compensation response, an inertial response, and a restored primary sensor response.

Abstract: A resonant mechanical structure, such as one for use in a torsional oscillator MEMS accelerometer that includes a mounting substrate and a reference mass configured to move within a reference mass plane, the resonant mechanical structure being connected to the mounting structure and the reference mass, and the resonant mechanical structure including a body, a center of mass, and an aperture, wherein the aperture is surrounded and defined by the body, and wherein the body includes a first mass portion and a second mass portion that are configured to oscillate about an oscillation axis located within the reference mass plane, wherein the center of mass is located on the oscillation axis, and wherein a movement of the reference mass within the reference mass plane varies a moment of inertia of the body while the center of mass of the body remains located on the oscillation axis.

Abstract: A resonant mechanical structure, such as one for use in a torsional oscillator MEMS accelerometer that includes a mounting substrate and a reference mass configured to move within a reference mass plane, the resonant mechanical structure being connected to the mounting structure and the reference mass, and the resonant mechanical structure including a body, a center of mass, and an aperture, wherein the aperture is surrounded and defined by the body, and wherein the body includes a first mass portion and a second mass portion that are configured to oscillate about an oscillation axis located within the reference mass plane, wherein the center of mass is located on the oscillation axis, and wherein a movement of the reference mass within the reference mass plane varies a moment of inertia of the body while the center of mass of the body remains located on the oscillation axis.