Patents by Inventor Clinton James WILBER

Clinton James WILBER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTENNA PANEL DISPLACEMENT
    Publication number: 20250233642
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a rank information change signal associated with rules for switching between a two-layer (2L) mode and a four-layer (4L) mode via an antenna panel displacement operation. The UE may transmit a transition time parameter associated with an amount of time for transitioning between the 2L mode and the 4L mode. Numerous other aspects are described.
    Type: Application
    Filed: January 12, 2024
    Publication date: July 17, 2025
    Inventors: Vasanthan RAGHAVAN, Tao LUO, Yu-Chin OU, Mohammad Ali TASSOUDJI, Neil BURNS, Kristi Lee WINTER, Clinton James WILBER
  • Antenna and device configurations
    Patent number: 12315986
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: May 27, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Darryl Jessie, Gurkanwal Sahota, Kevin Hsi Huai Wang, Jeong Il Kim, Taesik Yang, Thomas Myers, Neil Burns, Julio Zegarra, Clinton James Wilber, Jordan Szabo
  • ANTENNA AND DEVICE CONFIGURATIONS
    Publication number: 20220166127
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 26, 2022
    Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong IL KIM, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
  • Antenna module configurations
    Patent number: 11245175
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: February 8, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Darryl Jessie, Gurkanwal Sahota, Kevin Hsi Huai Wang, Jeong Il Kim, Taesik Yang, Thomas Myers, Neil Burns, Julio Zegarra, Clinton James Wilber, Jordan Szabo
  • Multi-band wireless signaling
    Patent number: 10971819
    Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 6, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Guining Shi, Young Jun Song, Allen Minh-Triet Tran, Mohammad Ali Tassoudji, Elizabeth Wyrwich, Julio Zegarra, Clinton James Wilber, Neil Burns, Jorge Fabrega Sanchez
  • MULTI-BAND WIRELESS SIGNALING
    Publication number: 20190260127
    Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 22, 2019
    Inventors: Guining SHI, Young Jun SONG, Allen Minh-Triet TRAN, Mohammad Ali TASSOUDJI, Elizabeth WYRWICH, Julio ZEGARRA, Clinton James WILBER, Neil BURNS, Jorge FABREGA SANCHEZ
  • ANTENNA MODULE CONFIGURATIONS
    Publication number: 20190103653
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong KIM, II, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO