Abstract: A contact height adjustment structure for a flexible circuit board is provided for making a plurality of conductive zones on a first surface of the flexible circuit board in tight contact engagement with corresponding contact points of a circuit device. The flexible circuit board is provided, on a second surface opposite to the first surface, with a plurality of height adjustment pads that are arranged at intervals and correspond, in a one-to-one manner, to the plurality of conductive zones. The plurality of height adjustment pads provide the plurality of conductive zones with a pushing force toward the corresponding contact points of the circuit device, so as to adjust a contact height of the conductive zones and to achieve an effect of setting the conductive zones in tight contact engagement with the corresponding contact points.

Abstract: A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.