Abstract: A bridging chamber is constructed between adjacent substrate processing workstation systems and connected by ports constructed in the adjacent substrate processing workstation systems. Transport mechanisms are used to move the substrates into and out of the bridging chamber to bypass primary transport systems.

Abstract: A sorter for handling and sorting semiconductor wafers is provided. The sorter has a housing, a handling and transport device and at least one nonproduction wafer buffer module. The housing has at least one holding area for interfacing one or more semiconductor wafer carriers to the housing. The housing defines an access path along which semiconductor wafers are transported between the housing and the one or more semiconductor wafer carriers. The handling and transport device is connected to the housing for transporting semiconductor wafers along the access path. The at least one nonproduction wafer buffer module is connected to the housing. The at least one nonproduction wafer buffer module buffers nonproduction wafers sorted by the sorter to one or more semiconductor wafer carriers.

Abstract: Amongst other things, a material handling system comprises a controller; a transport system, the transport system comprising transport track sections and at least one transport vehicle, the at least one transport vehicle configured to move along the transport track sections and configured to transport a carrier; and at least one identification tag reader located along a particular transport track section, the at least one identification tag reader being configured to read an identification tag of the carrier being transported by the at least one transport vehicle and being further configured to send a information signal to the controller; wherein the controller is configured to verify at least a location of the carrier based on the information signal.