Abstract: A method of reducing lighting energy by applying pulsed power cycle control to fast response lamps such as LEDs in a way that eliminates perceptible flicker while producing measureable and perceptible brightness equal to that of a steady current applied to similar lamps.

Abstract: A comfortably, yet highly efficient therapy pad that is effective in delivering cold or hot thermal therapy for the relief of pain, inflammation, swelling, and muscle stiffness.

Abstract: A Transcutaneous Electrical Nerve Stimulator (TENS) and electrode pad that is capable simultaneously of delivering hot or cold thermal therapy for the relief of pain.

Abstract: A topical mixture, that when massaged onto the skin, enables infusion of drugs or herbal compounds into deeper tissues, and a method of enhancing the penetration and concentration of drugs and herbs into tissues, especially as relates to treatment of pain.

Abstract: An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. The apparatus for planarizing a workpiece may include first and second polishing surfaces where the first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus may also have a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. An apparatus for planarizing a workpiece which includes a plurality of polishing stations is also disclosed.

Abstract: Method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer and the lapping surface.

Abstract: An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. In another exemplary embodiment, an apparatus for planarizing a workpiece includes at least a first and a second polishing surfaces. The first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus also has a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. In another exemplary embodiment, an apparatus for planarizing a workpiece includes a plurality of polishing stations.

Abstract: A method of making polishing pads used for the planarization of semiconductor wafers wherein the pad includes a polymer sleeve filled with an optical polymer to provide a window for the pad. An opaque polishing pad polymer is molded around the sleeve and window to form a large volume cake which is then cured and subdivided into a multiplicity of individual pads.

Abstract: The present invention is an apparatus and method for manufacturing a window into a polishing pad used during a planarization process of a front surface of a wafer. A hole is created in the polishing pad at a location where a window is desired. A first release film may be pressed against the working surface of the polishing pad thereby covering one end of the hole. Window material of suitable mechanical, chemical and optical properties is cast in the hole. A second release film may also be pressed against the bottom surface of the polishing pad covering the other end of the hole. The window material is preferably cured with light to quickly form and bond the window into the hole. The release films may be removed leaving the cast window in the polishing pad.

Abstract: The invention is a chemical-mechanical polishing wafer carrier that is able to apply a plurality of different pressures, with minimal discontinuities at the interfaces between different pressures, through a diaphragm to a back surface of a wafer. A plurality of concentric balloons, that may be individually pressurized, is used to support and press on the back surface of the diaphragm. The walls of the balloons are preferably thin and elastic and preferably do not attach to the diaphragm. This helps to minimize any pressure discontinuities on the diaphragm along the interfaces between the balloons. A wafer may be placed against the front surface of the diaphragm allowing the front surface of the diaphragm to retain and press against the back surface of the wafer during a planarization process.

Abstract: A flexible membrane for a wafer polishing apparatus has a central contact portion, an annular bending element connected to the central contact portion and an outer annual ring connected to the annular bending element. The membrane is configured to apply uniform pressure to a workpiece during polishing.

Abstract: A reinforced bladder for a chemical-mechanical planarization (CMP) polishing device includes an elastomer infused with a reinforcing material. The elastomer can be a rubber such as EPDM. The reinforcing material can be a chopped fiber such as aramid. Alternatively, the reinforcing material can be a sheet (such as a triaxial or hexaxial weave of aramid) embedded in and infused with the elastomer.

Abstract: A homogeneous polishing pad for chemical mechanical planarization of a workpiece has a thickness of at least about 1 millimeter. The polishing pad is friable and includes an abrasive material that is uniformly distributed throughout the pad. The abrasive material exhibits abrasive behavior that does not degrade significantly as the pad wears during planarization and conditioning.

Abstract: A bladder carrier assembly having a retaining ring permanently bonded to a bladder to form a one-piece disposable bladder assembly. The retaining ring includes a rigid ring member, preferably steel, and a layer of wear resistant material, such as ultra high molecular weight polyethylene or polyether ethyl ketone, which is molded around predetermined portions of the rigid ring member. The bladder is also molded to the retaining ring and an optional template may be molded to a surface of the bladder which lies adjacent a wafer to be polished.

Abstract: A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.

Abstract: The instant invention relates generally to abrasive stones for use in processing workpiece surfaces. The abrasive stones generally are produced by combining an epoxy novalac resin mixture with microballoons and a catalyst. The mixture is put into a mold, cold pressed, and then cured, creating abrasive stones having a uniform surface and bulk structure with a uniform hardness, suitable for workpiece processing.

Abstract: A non-cellular lapping pad is employed in a chemical mechanical planarization machine in conjunction with a polishing slurry to planarize the surface of a silicon workpiece. Planarization is effected by pressing the workpiece against the pad and moving the pad relative to the workpiece in at least one direction. The pad may be constructed of a porous material capable of adsorbing and entraining the slurry, such as fused polyethylene or non-cellular urethane. The pad may also be constructed may be made of a soft material to avoid damage to integrated circuit devices present on the surface of the silicon workpiece, such as a flexibilized epoxy. The slurry is a chemically and mechanically active solution comprising abrasive particles coupled with chemically reactive agents. The abrasive particles have a size of 10-200 nanometers, and suitable particle materials include colloidal silica, cerium oxide and alumina.

Abstract: The present invention relates generally to abrasive stone pads for use in processing workpiece surfaces. The abrasive stones generally are produced by combining a phenolic resin mixture with a diluent and then injecting microballoon structures into the resin/diluent mixture to create a porous solution. The diluent is initially ball milled with an abrasive in a tumbler to eliminate the agglomerates and is then added to a resin monomer. A suitable catalyst is added to the mixture to create a chemical reaction, further increasing the porocity of the substance. The mixture is poured into molds and with through a filter or frit plate to remove excess resin and diluent. Finally, the mixture is cured, creating abrasive stones having a uniform surface and bulk structure with a uniform hardness, suitable for workpiece grinding.