Patents by Inventor Clinton P. Sakata

Clinton P. Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
    Patent number: 10256120
    Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Clinton P. Sakata, Hui Chen, Jim K. Atkinson, Brian J. Brown, Jianshe Tang, Yufei Chen, Yunshuang Ding
  • SYSTEMS, METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE BUFF PRE-CLEANING
    Publication number: 20150114430
    Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Inventors: Clinton P. Sakata, Hui Chen, Jim K. Atkinson, Brian J. Brian, Jianshe Tang, Yufei Chen, Yunshuang Ding
  • METHODS AND APPARATUS FOR INDICATING A POLISHING TAPE END
    Publication number: 20100105290
    Abstract: Apparatus and methods are provided for polishing a substrate with a polishing tape. The polishing tape includes a first surface adapted to contact a substrate; and a second surface, wherein at least one of the first and second surfaces include a feature adapted to indicate an end condition. Numerous other aspects are provided.
    Type: Application
    Filed: October 24, 2008
    Publication date: April 29, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Clinton P. Sakata, Jim K. Atkinson, Eashwer Kollata, Gary C. Ettinger