Abstract: Embodiments of the disclosure include an apparatus and method of cleaning a substrate. A method of cleaning a substrate, includes rotating, a substrate table by first motor, delivering a fluid to a surface of a substrate positioned on a supporting surface of the substrate table of a cleaning module, rotating a cleaning pad at a cleaning speed, and sensing an initial torque value generated by a second motor with a controller, lowering the cleaning pad with a lift actuator assembly until the controller senses a contact torque generated by the second motor. The contact torque is when a pad processing surface of the cleaning pad contacts a surface of the substrate at a contact point. The method includes translating the cleaning pad a cleaning distance towards the substrate by a command from the controller. The cleaning pad is compressed by the translation of the cleaning pad the cleaning distance. The pad processing surface of the cleaning pad is then translated across the substrate supporting surface.

Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

Abstract: Apparatus and methods are provided for polishing a substrate with a polishing tape. The polishing tape includes a first surface adapted to contact a substrate; and a second surface, wherein at least one of the first and second surfaces include a feature adapted to indicate an end condition. Numerous other aspects are provided.