Patents by Inventor Clive HUI

Clive HUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250210910
    Abstract: Disclosed is a headphone audio cable connection structure, including a headphone body and an audio cable, where the headphone body is provided with an audio cable insertion hole and a clamping sleeve, the audio cable extends into the clamping sleeve and is inserted into the audio cable insertion hole, inserting grooves and clamping grooves are formed on a side wall of the clamping sleeve, the audio cable is sleeved with a clamping seat, and protruding clamping blocks are arranged on the clamping seat. The present disclosure ensures a stable connection of the audio cable, prevents the audio cable from falling off, and facilitates replacement of the audio cable.
    Type: Application
    Filed: June 21, 2024
    Publication date: June 26, 2025
    Applicant: HEYUAN YUANFENG ELECTRONICS CO., LTD.
    Inventors: Clive HUI, Xixiang LIU, Jingtao LAI
  • Patent number: D1128648
    Type: Grant
    Filed: December 19, 2024
    Date of Patent: June 2, 2026
    Assignee: HEYUAN YUANFENG ELECTRONICS CO., LTD.
    Inventors: Clive Hui, Xixiang Liu, Jingtao Lai