Patents by Inventor Clive R. Hendricks

Clive R. Hendricks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10741536
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: August 11, 2020
    Assignee: Intel Corporation
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Publication number: 20190279973
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material: a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadla, Clive R. Hendricks
  • Patent number: 10340260
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: July 2, 2019
    Assignee: Intel Corporation
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Publication number: 20180197845
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Application
    Filed: March 5, 2018
    Publication date: July 12, 2018
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Patent number: 9911723
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: March 6, 2018
    Assignee: Intel Corporation
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Publication number: 20170179094
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Patent number: 7884695
    Abstract: A low-resistance inductor is made from a plurality of first inter-abutting insulated electrode coil sub-segments that is coupled to a plurality of second intra-abutting insulated electrode coil sub-segments that are contiguous to the plurality of first intra-abutting coil sub-segments. The first plurality and the second plurality form an helical inductor unit cell. A process of forming the low-resistance inductor includes heat curing. A system includes a low-resistance inductor and a mounting substrate.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: February 8, 2011
    Assignee: Intel Corporation
    Inventors: Larry E. Mosley, Clive R. Hendricks
  • Patent number: 7724498
    Abstract: A low-inductance capacitor exhibits a first characteristic inductance during use in a first capacitor subsection and a second characteristic inductance during use in a second capacitor subsection, and the first and second characteristic inductances act to neutralize each other. A process of forming the low-inductance capacitor includes heat curing. A package includes a low-inductance capacitor and a mounting substrate.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: May 25, 2010
    Assignee: Intel Corporation
    Inventors: Larry E. Mosley, Clive R. Hendricks
  • Publication number: 20080048813
    Abstract: A low-resistance inductor is made from a plurality of first inter-abutting insulated electrode coil sub-segments that is coupled to a plurality of second intra-abutting insulated electrode coil sub-segments that are contiguous to the plurality of first intra-abutting coil sub-segments. The first plurality and the second plurality form an helical inductor unit cell. A process of forming the low-resistance inductor includes heat curing. A system includes a low-resistance inductor and a mounting substrate.
    Type: Application
    Filed: June 30, 2006
    Publication date: February 28, 2008
    Inventors: Larry E. Mosley, Clive R. Hendricks
  • Publication number: 20080001253
    Abstract: A low-inductance capacitor exhibits a first characteristic inductance during use in a first capacitor subsection and a second characteristic inductance during use in a second capacitor subsection, and the first and second characteristic inductances act to neutralize each other. A process of forming the low-inductance capacitor includes heat curing. A package includes a low-inductance capacitor and a mounting substrate.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Larry E. Mosley, Clive R. Hendricks