Abstract: A low-cost package for electronic components is achieved by utilizing an egrally molded, lightweight plastic enclosure having a laminated construction with inner and outer shells fabricated of lightweight, high-impact resistant plastic having sandwiched therebetween a suitable filler material to provide stiffening and structural damping. Self-contained heat pipes may be imbedded in the shell walls to provide the necessary cooling. The inner shell is formed with the necessary drawer or chassis supporting hardware through the use of molded-in-place inserts. The interior wall surfaces of the inner shell may be vacuum metalized to provide required radio frequency shielding.