Abstract: A socket is provided for testing leadless chip carriers. The socket has a base with a resilient pad. A planar assembly of coaxial cables is positioned above the base so that a terminal contact of each cable is located on the resilient pad in alignment with the contacts on the chip carrier. A frame is coupled to the planar assembly of coaxial cables and to the base. The frame has an opening for receiving and aligning the contacts of the carrier with the contacts of each coaxial cable. The socket has a cover which is hinged and latched to the base. A screw threaded through the cover is used to apply pressure to the carrier in the socket.

Abstract: Disclosed is an inter-connect board adapted to regularize the means of connecting chip elements, such as coils for a bubble memory, to various related I/O leads, without making this interconnection manually.

Abstract: A bi level electrical inductance coil wherein flat, thin conductors are formed and supported on both sides of a flexible dielectric substrate such that the center line of the conductors on one side overlays the space between the conductors on the other side and such that both ends of each conductor are formed so as to be interdigitated; the ends on one side of the substrate interdigitated with the ends on the other side of the substrate; the substrate and conductors bent so that the conductor ends contact adjacent conductor ends to form continuous turns thus forming a relatively thin flat coil with overlapping conductors to provide a uniform magnetic field particularly useful in bubble memories.

Abstract: A magnetic bubble memory packaging tool comprising a stationary base having a bias magnet replaceable mounting arm which cooperates with a moveable bias magnet replaceable mounting arm on a moveable base, the latter being coupled to move relative to said stationary base by a spring biased screw arrangement. With the bias magnets positioned on opposite sides of the mounting arms and with the yoke positioned to a compass the arms, and the bias magnets, rotation of the screw increases the bias of the spring urging the arms and magnets in a direction away from each other and into engagement with the inside walls of the yoke. The spring bias is a measure of the pressure with which the bias magnets engage the yoke for bonding and the screw is calibrated so as to select the bias of the spring.

Abstract: A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.