Abstract: An electrical socket contact with a plurality of tines for mating with a pin contact. At least one tine functions as an initial arc receiving tine while another tine functions as an axially extending pin contacting tine. The pin contacting tine has a shorter axial length than the arc receiving tine so that the arc receiving tine produces a make-first/break-last electrical contact.

Abstract: A low insertion force electrical socket contact has a plurality of inwardly extending projections that function as arc receiving elements upon the initial mating of the socket contact with a corresponding male pin contact. The spacing of the inwardly extending arc receiving elements is such that the maximum transverse distance therebetween across the socket contact bore is greater than the maximum transverse distance of the male pin contact. Further insertion mating of the male pin contact establishes electrical contact with a plurality of integrally formed spring contacts in the socket contact.

Abstract: A cross-connection assembly (10) including a plurality of cross-connection sites (14) provided by housing modules (30) secured to a base frame (12). Each site (14) is defined by a silo (52) containing a first terminal (60) and an actuator (120) secured thereatop rotatable to terminate a first wire (112) to the first terminal. At a selected site, a second terminal (160) is mountable to the actuator (120) thereat to electrically engage the first terminal, and a corresponding cap (190) over the second terminal is initially rotatable with respect to actuator (120) in order to terminate a second wire (220) at the site. Upon the first rotation the cap becomes locked to the actuator, providing that later rotation of the cap also moves the actuator and second terminal and second wire of necessity to permit untermination and retermination of the first wire (112) with respect to the first terminal (60).

Abstract: A modular socket for an integrated circuit package, wherein a single base is adapted to receive a plurality of replaceable contact modules having a variety of conductive lead counts. The modularity permits tooling of a single base to accommodate a variety of integrated circuit packages.The socket includes a lid pivotally connected to the base by a hinge and hinge pin. The hinge pin defines a pivot axis which is in a plane with the bottom surface of the lid to limit lateral movement on the contacts carried by the module.

Abstract: A zero insertion force socket using normally closed contacts and three adjacently overlying plates. Upon lifting the activating arm, a cammed cylinder is rotated which pushes the middle plate and pulls the top plate to thereby open the prongs of the contact for component lead insertion therebetween. Upon the activating arm being moved back into its original position the cammed cylinder rotates and the middle plate shifts back to its original position under the influence of a contact prong closing about the component lead as the top plate shifts back to its original position under the influence of the cammed cylinder.

Abstract: A socket device for an integrated circuit package having fine pitch or closely spaced leads or contact pads. The socket device includes a base having a platform for supporting the IC package. Opposed actuating latches are pivotally carried upon the base at opposite sides of the platform to accommodate receipt and retention of the integrated package. The socket device includes a plurality staggered contacts in multiple ranks at opposite sides of the platform adjacent the actuator latches. The contacts engage the actuator latches so as to be moved between open and closed positions upon pivotal movement of the latches.

Abstract: A chip connector which includes conductive contacts which electrically contact the carrier. The contacts include an outwardly extending cantilevered projection to allow the contacts to be shifted outwardly on downward engaging movement of the connector top to allow insertion or removal of the chip. The connector base includes a wall positioning part which biases the contacts into a preloaded or clamped position.

Abstract: A connector for a leadless chip carrier. The connector includes a base which has opposed latches and a spring biased camming actuator which shifts the latches into a clamped position to secure the chip carrier within the base.

Abstract: A zero insertion force connector is provided for a dual-in-line integrated circuit package. The connector includes a base, a plurality of spring loaded contacts mounted in recesses extending along opposed sides of the base, and a frame which surrounds and is slidably mounted on the base. The recesses in which the contacts are mounted correspond in number and spacing to the leads on the integrated circuit package. The frame is slidably movable between extreme raised and lowered positions, and includes cam fingers aligned with the respective contacts. The frame is constructed such that in its lower position the cam fingers thereof urge the leads of the integrated circuit package against the contacts mounted in the base.

Abstract: A connector assembly is disclosed for mounting a module on a circuit board or the like without requiring any soldering. The subject assembly includes a header mounted on a circuit board to at least partially enclose an area of contacts integral with the circuit board. A plug assembly is secured to a mating module and adopted to engage in the header. The plug assembly includes an outer housing enclosing an inner housing which is directly attached to the module and movable within the outer housing. At least one series of spring terminals are mounted in the plug assembly with a first portion engaging the outer housing and a second portion bearing against the module carried by the inner housing. Spring bias means are mounted in the outer housing bearing against the opposite side of the inner housing from the terminals.