Abstract: A workpiece support apparatus for use in a process vessel and process system for treating semiconductor workpieces. The process vessel is to be utilized in an integrated tool for wet chemical treatment of a semiconductor workpiece. The workpiece support apparatus includes a rotor having a central cavity and guide pins mounted at an outer perimeter. A workpiece support having extendable workpiece support fingers is connected to the rotor. The extendable workpiece support fingers are moveable from a first position to a second position. A bellows seal connects the workpiece support to the rotor. A fluid delivery tube is positioned in the central cavity of the rotor and connected to a supply of fluid.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.

Abstract: A system for processing a wafer using ozone includes an ozone gas source connecting into the process chamber. Wafers are held within a holder or fixture in the chamber. A chamber exhaust line connects the process chamber to an inlet at the top end of an ozone destructor. A system or cabinet exhaust line extends from an outlet also at the top end of the ozone destructor. A canister within the ozone destructor contains a catalyst. Exhaust flow from the process chamber moves down through the ozone destructor and then up through the catalyst. Saturation of the catalyst by condensing water vapor and loss of catalytic efficiency, is reduced. As the process chamber and chamber exhaust line are better isolated from the catalyst, potential for catalyst particles moving into the process chamber or chamber exhaust line, or for condensing vapor to back up in the chamber exhaust line, are reduced.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.