Abstract: Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.

Abstract: A switchable capacitor having: a dielectric; a pair of electrodes, a first one of the electrodes having the dielectric thereon and a second, flexible one of the electrodes being suspended over the dielectric when the switchable capacitor is in an de-activated state; and top plate disposed between the dielectric and the second, flexible electrode and connected to a reference potential. When the switchable capacitor is electrostatically driven to an activated state, the second one of the electrodes contacts the top plate and when the switchable capacitor is returned to the de-activated state, charge on the top plate is discharged to the reference potential.

Abstract: Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.

Abstract: Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.

Abstract: A switchable capacitor having: a dielectric; a pair of electrodes, a first one of the electrodes having the dielectric thereon and a second, flexible one of the electrodes being suspended over the dielectric when the switchable capacitor is in an de-activated state; and top plate disposed between the dielectric and the second, flexible electrode and connected to a reference potential. When the switchable capacitor is electrostatically driven to an activated state, the second one of the electrodes contacts the top plate and when the switchable capacitor is returned to the de-activated state, charge on the top plate is discharged to the reference potential.

Abstract: A structure having a plurality serially coupled variable capacitors, each one of the variable capacitors having a pair of plates, one of the plates being electrostatically moveable relative to the other one of the plates, to provide each one of the variable capacitors with a variable capacitance; and a transmission line. A first one of the variable capacitors has a first one of the one plates thereof coupled between and input and output of the transmission line and a second one of the plates thereof serially coupled to a first one of the plates of a second one of the variable capacitors.

Abstract: Self powered microelectromechanical oscillators are provided for various applications.

Abstract: Hermetically sealed semiconductor wafer packages that include a first bond ring on a first wafer facing a complementary surface of a second bond ring on a second wafer. The package includes first and second standoffs of a first material, having a first thickness, formed on a surface of the first bond ring. The package also includes a eutectic alloy (does not have to be eutectic, typically it will be an alloy not specific to the eutectic ratio of the elements) formed from a second material and the first material to create a hermetic seal between the first and second wafer, the eutectic alloy formed by heating the first and second wafers to a temperature above a reflow temperature of the second material and below a reflow temperature of the first material, wherein the eutectic alloy fills a volume between the first and second standoffs and the first and second bond rings, and wherein the standoffs maintain a prespecified distance between the first bond ring and the second bond ring.

Abstract: Self powered microelectromechanical oscillators are provided for various applications.