Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

Abstract: A method of dampening a force applied to an electrically-actuatable element during a transfer of the electrically-actuatable element from a first side of a first substrate to a second substrate. The method includes positioning a needle adjacent a second side of the first substrate opposite the first side of the first substrate. The needle is moved via a needle actuator to a position at which the needle presses on the second side of the first substrate to press the electrically-actuatable element into contact with the second substrate disposed adjacent the first side of the first substrate. A force applied to the electrically-actuatable element is dampened when the needle presses the electrically-actuatable element into contact with the second substrate.

Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.

Abstract: An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.

Abstract: An apparatus includes a first display, an indicium, and a second display. The second display can include a light-generating source deposited on a substrate. The second display illuminates the indicium and the second display has a thickness of less than 0.25 millimeters. The apparatus also includes one or more controllers communicatively coupled to the first display and the second display and configured to control states of the first display and the second display.

Abstract: A backlighting apparatus for an LCD display includes a substrate and a circuit trace disposed on a surface of the substrate. The apparatus further includes a plurality of light sources affixed to the substrate via the circuit trace in a predetermined pattern across the surface of the substrate. Each light source includes one or more micro-sized, unpackaged LEDs. A height of the one or more micro-sized, unpackaged LEDs is from about 12 microns to about 200 microns.

Abstract: A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

Abstract: An electronic device comprising a housing having a front and a back; a component embedded within the front or the back of the housing; and an array of light-generating sources (LGSs) deposited on a substrate disposed in the housing, the array of LGSs being disposed adjacent at least a portion of the component of the electronic device.

Abstract: An apparatus includes a first display, an indicium, and a second display. The second display can include a light-generating source deposited on a substrate. The second display illuminates the indicium and the second display has a thickness of less than 0.25 millimeters. The apparatus also includes one or more controllers communicatively coupled to the first display and the second display and configured to control states of the first display and the second display.

Abstract: An apparatus includes a first display, an indicium, and a second display. The second display can include a light-generating source deposited on a substrate. The second display illuminates the indicium and the second display has a thickness of less than 0.25 millimeters. The apparatus also includes one or more controllers communicatively coupled to the first display and the second display and configured to control states of the first display and the second display.

Abstract: A keyboard apparatus includes a key cover having a plurality of holes that extend through a thickness of the cover from a top side of the cover to a bottom side of the cover. The plurality of holes are arranged to collectively form a predetermined shape. A mask layer is disposed at the bottom side of the cover. A first region of the mask layer is opaque and a second region of the mask layer allows light to pass therethrough to the plurality of holes. A light source is disposed beneath the mask layer and positioned such that light emitted from the light source passes through the second region of the mask layer to the plurality of holes. A sensory contact terminal is disposed beneath the mask layer, and the terminal detects a keystroke movement.

Abstract: A method for executing a direct transfer of semiconductor device die from a first substrate to transfer locations on a second substrate. The method includes determining a position of impact wires disposed on a transfer head, semiconductor device die, and transfer locations; determining whether there are at least two positions that an impact wire, a semiconductor device die, and a transfer locations are aligned within a threshold tolerance; and transferring, by the impact wires, the semiconductor device die such that the semiconductor device die detaches from the first substrate and attaches to transfer locations on the second substrate. The transferring being completed based at least in part on determining that the impact wire, the semiconductor device die, and the circuit trace are aligned within the threshold tolerance.

Abstract: A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

Abstract: A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

Abstract: A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

Abstract: A display device includes lighting elements and/or circuit arrangements including lighting elements that are configured to, at a predetermined time, receive a boost of stored energy and emit a brightness level greater than the brightness level that is emitted with the use of the lighting elements and/or circuit arrangements when not using the stored energy.

Abstract: A keyboard apparatus includes a key cover having a plurality of holes that extend through a thickness of the cover from a top side of the cover to a bottom side of the cover. The plurality of holes are arranged to collectively form a predetermined shape. A mask layer is disposed at the bottom side of the cover. A first region of the mask layer is opaque and a second region of the mask layer allows light to pass therethrough to the plurality of holes. A light source is disposed beneath the mask layer and positioned such that light emitted from the light source passes through the second region of the mask layer to the plurality of holes. A sensory contact terminal is disposed beneath the mask layer, and the terminal detects a keystroke movement.

Abstract: A system performs a direct transfer of a semiconductor device die from a first substrate to a second substrate. A semiconductor device die is disposed on a first side of the first substrate. The system includes a first conveyance mechanism to convey the first substrate, and a second conveyance mechanism to convey the second substrate with respect to the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also comprises a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

Abstract: An electronic device comprising a housing having a front and a back; a component embedded within the front or the back of the housing; and an array of light-generating sources (LGSs) deposited on a substrate disposed in the housing, the array of LGSs being disposed adjacent at least a portion of the component of the electronic device.

Abstract: A backlighting apparatus for an LCD display includes a substrate and a circuit trace disposed on a surface of the substrate. The apparatus further includes a plurality of light sources affixed to the substrate via the circuit trace in a predetermined pattern across the surface of the substrate. Each light source includes one or more micro-sized, unpackaged LEDs. A height of the one or more micro-sized, unpackaged LEDs is from about 12 microns to about 200 microns.