Patents by Inventor Coenraad Tak

Coenraad Tak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors
    Patent number: 10192842
    Abstract: A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: January 29, 2019
    Assignee: ams International AG
    Inventors: Hendrik Bouman, Roel Daamen, Coenraad Tak
  • SENSOR PACKAGE AND MANUFACTURING METHOD
    Publication number: 20150171042
    Abstract: A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip.
    Type: Application
    Filed: December 10, 2014
    Publication date: June 18, 2015
    Inventors: Hendrik Bouman, Roel Daamen, Coenraad Tak