Patents by Inventor Colby Greg Ramply

Colby Greg Ramply has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER WITH SEMICONDUCTOR DEVICES AND INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION
    Publication number: 20220392856
    Abstract: A wafer includes a substrate that includes a channel layer, a first active region, a second active region, and a saw street region between the first active region and the second active region. The wafer includes a first device formed on the substrate in the first active region. The first device includes a first portion of the channel layer. The wafer includes a second device formed on the substrate in the second active region. The second device includes a second portion of the channel layer. The wafer includes a conductive channel between the first active region and the second active region. The conductive channel is in the saw street of the wafer and includes a third portion of the channel layer.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 8, 2022
    Inventors: Colby Greg Ramply, Bruce McRae Green, David Cobb Burdeaux