Patents by Inventor Colby L. Heideman

Colby L. Heideman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low thermal conductivity misfit layer compounds with layer to layer disorder
    Patent number: 8545991
    Abstract: Compositions comprise an alternating plurality of ordered layers of a first composition MX and a second composition TX2, wherein M is one of Sn, Pb, Sb, Bi, or a rare earth metal, X is S or Se and T is Ti, V, Cr, Nb, or Ta. In some examples, the alternating plurality of ordered layers conforms to a substrate. In typical examples, each of the ordered layers of the first composition has a common thickness and/or each of the ordered layers of the first material has a common composition. In some examples, each of the ordered layers of the second composition has a common thickness and/or a common composition.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: October 1, 2013
    Assignee: State of Oregon Acting by and Through the State Board of Higher Education on Behalf of the University of Oregon
    Inventors: David C. Johnson, Ngoc T. Nguyen, Qiyin Lin, Colby L. Heideman, Clay Mortensen
  • LOW THERMAL CONDUCTIVITY MISFIT LAYER COMPOUNDS
    Publication number: 20100233454
    Abstract: Compositions comprise an alternating plurality of ordered layers of a first composition MX and a second composition TX2, wherein M is one of Sn, Pb, Sb, Bi, or a rare earth metal, X is S or Se and T is Ti, V, Cr, Nb, or Ta. In some examples, the alternating plurality of ordered layers conforms to a substrate. In typical examples, each of the ordered layers of the first composition has a common thickness and/or each of the ordered layers of the first material has a common composition. In some examples, each of the ordered layers of the second composition has a common thickness and/or a common composition.
    Type: Application
    Filed: January 25, 2010
    Publication date: September 16, 2010
    Inventors: David C. Johnson, Ngoc T. Nguyen, Qiyin Lin, Colby L. Heideman, Clay Mortensen