Abstract: A wafer scrubbing machine is provided with a network of wafer holders which can be moved from a retracted position adjacent each other at a wafer receiving station to an expanded position spaced apart from each within a scrubbing station. The wafers are picked up simultaneously by pairs of depending arms in the scrubbing station and passed between pairs of rotating brushes for cleaning purposes. A common drive wheel is provided to rotate the wafers simultaneously during scrubbing between the brushes. A second network of wafer holders is provided to receive the scrubbed wafers in the scrubbing station and to move into a retracted position within a delivery station for transfer of the cleaned wafers into a cassette for subsequent processing. Two sets of networks may be provided on a common rotatable assembly in order to accommodate two different sizes of delivered wafers.