Patents by Inventor Colden Niles Eldridge

Colden Niles Eldridge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus, system, and method for implementing multipurpose screw holes in circuit packaging for mobile devices
    Patent number: 12213241
    Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: January 28, 2025
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Qiuming Li, Colden Niles Eldridge, Ming Lei, Yibo Liu, Md Rashidul Islam, Sung Hoon Oh
  • APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW HOLES IN CIRCUIT PACKAGING FOR MOBILE DEVICES
    Publication number: 20240251499
    Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Inventors: Qiuming Li, Colden Niles Eldridge, Ming Lei, Yibo Liu, Md Rashidul Islam, Sung Hoon Oh
  • Electromagnetic shielding structure for an overmolded printed circuit board
    Patent number: 11729897
    Abstract: The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: August 15, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Qiuming Li, Ming Lei, Colden Niles Eldridge, Yeonsoo Ko