Patents by Inventor Colin A. Bulthaup

Colin A. Bulthaup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040197712
    Abstract: In a system for contact printing, two surfaces are brought into intimate aligned contact, under controlled pressure, without the entrapment of air. A controlled bow in a stamp pushes air ahead of a moving contact line between the stamp and a substrate. In one embodiment, the bow is created by a difference in pressure between the two sides of a flexible stamp. In an alternate embodiment, a flexible stamp is rolled into contact with the substrate. Alignment of the stamp and any previously patterned features on the substrate is accomplished with an X-Y translation stage or other suitable mechanism. If an optically clear stamp is utilized, features in the stamp and the substrate can be compared simultaneously and the relative position adjusted. In another aspect, a pattern in a thin film of liquid is created by liquid embossing on an offset substrate. The offset substrate is then brought into contact with the final substrate and the high regions of the liquid film are transferred to that substrate.
    Type: Application
    Filed: December 2, 2003
    Publication date: October 7, 2004
    Inventors: Joseph M. Jacobson, Eric Jamesson Wilhelm, Colin A. Bulthaup, Alexander Henry Slocum, Emily Cathryn Warmann
  • Publication number: 20040013982
    Abstract: Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.
    Type: Application
    Filed: December 17, 2002
    Publication date: January 22, 2004
    Applicant: Massachusetts Institute of Technology
    Inventors: Joseph M. Jacobson, Colin A. Bulthaup, Eric J. Wilhelm, Brian N. Hubert
  • Patent number: 6517995
    Abstract: Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: February 11, 2003
    Assignee: Massachusetts Institute of Technology
    Inventors: Joseph M. Jacobson, Colin A. Bulthaup, Eric J. Wilhelm, Brian N. Hubert