Patents by Inventor Colin B. Bosch

Colin B. Bosch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible substrate for packaging a semiconductor component
    Patent number: 6300679
    Abstract: A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: October 9, 2001
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Prosanto K. Mukerji, Ronald E. Thomas, George W. Hawkins, Rajesh Srinivasan, Colin B. Bosch, James H. Knapp, Laura J. Norton, Michael J. Seddon
  • Semiconductor component and method of manufacture
    Patent number: 6093583
    Abstract: A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: July 25, 2000
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Prosanto K. Mukerji, Rajesh Srinivasan, Ronald E. Thomas, Colin B. Bosch, Peter J. Gillespie