Abstract: This invention generally relates to an optoelectronic device and a method of fabricating such a device, and more particularly to an optoelectronic device comprising an anode layer, a semiconductive layer provided over the anode layer, and a cathode layer provided over the semiconductive layer, the anode layer comprising a plurality of electrically conductive tracks connected together and spaced apart from one another with gaps therebetween, the device further comprising a first and one or more further hole injection layers provided between the anode layer and the semiconductive layer and extending across said gaps, wherein the first hole injection layer has a conductivity greater than the conductivity of the one or more further hole injection layers.

Abstract: A method of forming a light-emitting device comprises: forming patterned portions of precursor material over a substrate, the edges of the patterned portions defining sidewalls; performing a shaping control process on the patterned portions of precursor material to control the sidewall profile to reduce the angle the sidewalls of the precursor material make with the substrate to less than 15 degrees; selectively applying from solution a conductive coating onto the portions of shaped precursor material so as to form a plurality of first conducting contacts such that an upper surface of said conductive coating follows the sidewall profile of the precursor material; forming a light-emitting layer over the conductive contacts and substrate, and forming a plurality of second conducting contacts over the light-emitting layer. The precursor material may comprises an activator catalyst and the conductive coating comprises a metal selectively applied to the shaped precursor material by electroless plating.

Abstract: A layered structure for an organic electronic device comprising: •(i) a substrate; •(ii) an electrode deposited on said substrate; and •(iii) a hole injection layer (HIL) deposited on said electrode, wherein said electrode comprises a metal grid and an organic charge transporting polymer layer (CTL) which, together with said substrate, encapsulates said metal grid and protects it from being attacked by acidic species in the hole injection layer.

Abstract: We describe a lighting tile having a substrate bearing an electrode structure, the electrode structure comprising: a plurality of electrically conductive tracks disposed over said substrate; and an electrical connection region connecting to said plurality of tracks; wherein the height of said tracks tapers away from said connection region to compensate for a reduction in luminance from said lighting tile array from the electrical connection region which arises from a non-uniform voltage drop which appears along the tracks in use. Advantageously the tracks are fabricated by electroplating: then, as the rate of deposition is determined by the voltage drop along a track during plating, the height of the deposited tracks, and therefore their resistance, will match the profile required in operation to compensate for the reduction in luminance which would otherwise occur.

Abstract: This invention generally relates to planarisation of a surface of a substrate. In an embodiment of planarising a surface region of a substrate, the substrate having a body on a portion of said surface region, the method comprises: modifying the wetability of a surface of said body with respect to a liquid planariser composition by providing a surface modifying layer such as a self-assembled monolayer thereon; and then depositing the liquid planariser composition on said substrate and said body such that the planariser composition wets said surface region, wherein said surface modifying layer determines a contact angle of said liquid planariser composition to said surface of said body such that the deposited liquid planariser composition is repelled from said surface of said body.

Abstract: We describe a lighting tile having a substrate bearing an electrode structure, the electrode structure comprising: a plurality of electrically conductive tracks disposed over said substrate; and an electrical connection region connecting to said plurality of tracks; wherein the height of said tracks tapers away from said connection region to compensate for a reduction in luminance from said lighting tile array from the electrical connection region which arises from a non-uniform voltage drop which appears along the tracks in use. Advantageously the tracks are fabricated by electroplating: then, as the rate of deposition is determined by the voltage drop along a track during plating, the height of the deposited tracks, and therefore their resistance, will match the profile required in operation to compensate for the reduction in luminance which would otherwise occur.

Abstract: This invention generally relates to an optoelectronic device and a method of fabricating such a device, and more particularly to an optoelectronic device comprising an anode layer, a semiconductive layer provided over the anode layer, and a cathode layer provided over the semiconductive layer, the anode layer comprising a plurality of electrically conductive tracks connected together and spaced apart from one another with gaps therebetween, the device further comprising a first and one or more further hole injection layers provided between the anode layer and the semiconductive layer and extending across said gaps, wherein the first hole injection layer has a conductivity greater than the conductivity of the one or more further hole injection layers.

Abstract: This invention generally relates to planarisation of a surface of a substrate. In an embodiment of planarising a surface region of a substrate, the substrate having a body on a portion of said surface region, the method comprises: modifying the wetability of a surface of said body with respect to a liquid planariser composition by providing a surface modifying layer such as a self-assembled monolayer thereon; and then depositing the liquid planariser composition on said substrate and said body such that the planariser composition wets said surface region, wherein said surface modifying layer determines a contact angle of said liquid planariser composition to said surface of said body such that the deposited liquid planariser composition is repelled from said surface of said body.

Abstract: This document relates to methods and materials for detecting mutations that can be linked to dementia. For example, methods and materials for detecting one or more mutations within PGRN nucleic acid are provided. This document also provides methods and materials for detecting the level of progranulin expression. In addition, this document relates to methods and materials for treating mammals having a neurodegenerative disorder (e.g., dementia). For example, methods and materials for increasing PGRN polypeptide levels in mammals are provided, as are methods and materials for identifying agents that can be used to increase PGRN polypeptide levels in mammals.

Abstract: Tooling for facing a wall includes a plurality of cavities which are formed by four blades, each of the cavities corresponding to various brick sizes. Six lines of interconnected cavities are attached to a cross beam. Adjacent cavities and lines are spaced from another by a predetermined dimension. Unset settable building material is mixed with appropriate colouring and waterproofing agent and is applied to a wall to form an outer layer. The surface thereof is sponged to produce a brick like surface relief. The tooling is pressed into the outer layer to impress a pattern resembling brickwork. Unset material is sucked from the joint line space between adjacent cavities and the layer is allowed to set. Then, mortar is added to the joint line. Once the mortar has set, the final outer layer has a true brick finish that resembles a real brick wall. The unset settable material can be applied to damaged or wood walls so that a true brick finish can be given to a wall in a quick, simple and cost effective manner.

Abstract: Tooling for facing a wall includes a plurality of cavities which are formed by four blades, each of the cavities corresponding to various brick sizes. Six lines of interconnected cavities are attached to a cross beam. Adjacent cavities and lines are spaced from another by a predetermined dimension. Unset settable building material is mixed with appropriate coloring and waterproofing agent and is applied to a wall to form an outer layer. The surface thereof is sponged to produce a brick like surface relief. The tooling is pressed into the outer layer to impress a pattern resembling brickwork. Unset material is sucked from the joint line space between adjacent cavities and the layer is allowed to set. Then, mortar is added to the joint line. Once the mortar has set, the final outer layer has a true brick finish that resembles a real brick wall. The unset settable material can be applied to damaged or wood walls so that a true brick finish can be given to a wall in a quick, simple and cost effective manner.