Patents by Inventor Colin Bulthaup

Colin Bulthaup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030082485
    Abstract: The current invention is directed to a method of patterning a surface or layer in the fabrication of a micro-device. In accordance with a preferred embodiment of the invention, a first mask structure is formed by depositing a layer of a first material onto the surface or layer and embossing the layer with a micro-stamp structure. The layer is preferably embossed as a liquid, which is solidified or cured to form the first mask structure. The first mask structure can be used as an etch-stop mask which is removed in a subsequent processing step or, alternatively, the first mask structure can remain a functional layer of the micro-device. In further embodiments, unmasked regions of the surface or layer are chemically treated through the first mask structure and/or a second material is deposited onto the unmasked regions of the surface or layer through the first mask structure to form a second mask structure and/or a second functional layer of the micro-device.
    Type: Application
    Filed: September 20, 2002
    Publication date: May 1, 2003
    Inventors: Colin Bulthaup, Chris Spindt
  • Publication number: 20030070569
    Abstract: The current invention is directed to micro-stencil devices and methods. A micro-stencil, in accordance with this invention, comprises a patterned stencil membrane formed from a polymeric layer patterned with stencil features preferably having lateral dimensions in a range of 10 micron to 100 nanometers or less. The micro-stencil preferably includes a porous backing membrane coupled to the stencil membrane to control the flow of print fluids, to allow for two-way flow of print fluids and/or curing gases during a printing operation. The stencil membrane is preferably configured to directly print the stencil features onto a suitable print medium surface. The micro-stencil of the instant invention, is preferably utilized for printing structures comprising interconnected layers, such as micro-circuits, and/or structures comprising polymer arrays.
    Type: Application
    Filed: December 4, 2001
    Publication date: April 17, 2003
    Inventors: Colin Bulthaup, Brian Hubert, Kevin Hubert, Joseph Jacobson
  • Patent number: 6517995
    Abstract: Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: February 11, 2003
    Assignee: Massachusetts Institute of Technology
    Inventors: Joseph M. Jacobson, Colin A. Bulthaup, Eric J. Wilhelm, Brian N. Hubert