Patents by Inventor Colin Calabrese

Colin Calabrese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite materials for dielectric applications
    Patent number: 11920023
    Abstract: There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: March 5, 2024
    Assignee: Rohm and Haas Electronic Materials LLC.
    Inventors: Colin Hayes, Colin Calabrese, Christine Hatter
  • COMPOSITE MATERIALS FOR DIELECTRIC APPLICATIONS
    Publication number: 20230348706
    Abstract: There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 2, 2023
    Inventors: Colin HAYES, Colin CALABRESE, Christine HATTER
  • Photosensitive bismaleimide composition
    Patent number: 11639398
    Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 2, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Colin Hayes, Colin Calabrese, Michael K. Gallagher, Kevin Y. Wang, Robert K. Barr
  • Polymeric resin for dielectric applications
    Patent number: 11603422
    Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 14, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Colin Hayes, Colin Calabrese, Michael K Gallagher, Robert K Barr
  • BISMALEIMIDE CROSS-LINKER FOR LOW LOSS DIELECTRIC
    Publication number: 20210198396
    Abstract: The present disclosure relates to a chemical composition produced from polymerizing an arylcyclobutene monomer, and a bismaleimide compound as a cross-linker; and its use, especially in electronic devices.
    Type: Application
    Filed: December 7, 2020
    Publication date: July 1, 2021
    Inventors: Jaclyn Murphy, Colin Hayes, Michael K. Gallagher, Kristen Flajslik, Charles R. Kinzie, Colin Calabrese, Qing Min Wang
  • POLYMERIC RESIN FOR DIELECTRIC APPLICATIONS
    Publication number: 20210198395
    Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.
    Type: Application
    Filed: November 30, 2020
    Publication date: July 1, 2021
    Inventors: Colin Hayes, Colin Calabrese, Michael K Gallagher, Robert K Barr
  • PHOTOSENSITIVE BISMALEIMIDE COMPOSITION
    Publication number: 20210198389
    Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.
    Type: Application
    Filed: November 30, 2020
    Publication date: July 1, 2021
    Inventors: Colin Hayes, Colin Calabrese, Michael K. Gallagher, Kevin Y. Wang, Robert K. Barr