Abstract: A method for configuring components in a networked computer system comprising providing a configuration map that includes installation locations and sequences for network components. The configuration map is used to indicate component installation locations and sequences through a series of indicators. The component installation locations and sequences are confirmed after the components are configured according to the configuration map by an electrical connectivity test of each affected component.

Abstract: Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.

Abstract: Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.

Abstract: A hexagonal conductor path layout for power and ground distribution planes in a multi-layer VLSI device. The invention reduces crosstalk between switching devices in signal nets by reducing impedance in the distribution planes. Impedance is reduced by providing more direct line current paths and providing maximum path change angles of less than ninety degrees. Reduced impedance causes reduced coupling between current flows which share a common path and hence less crosstalk.

Abstract: A hexagonal conductor path layout for power and ground distribution planes in a multi-layer VLSI device. The invention reduces crosstalk between switching devices in signal nets by reducing impedance in the distribution planes. Impedance is reduced by providing more direct line current paths and providing maximum path change angles of less than ninety degrees. Reduced impedance causes reduced coupling between current flows which share a common path and hence less crosstalk.

Abstract: A set of conductive plates are positioned adjacent to and in close proximity with a unidirectional heatsink on a high frequency integrated circuit. The set of plates is generally electrically attached to the same ground potential voltage supply as the integrated circuit and serves to damped unwanted radio frequency electromagnetic radiation normally emitted by heatsinks. The same arrangement of plates can also serve as an external electromagnetic interference shield apparatus for the integrated circuit. The plates may alternatively be comprised of a conductive mesh to allow air flow through the plates.

Abstract: An interface module for an electronic system that permits signals to pass between a high frequency main circuit board area such as used for central processing units, memories, or other relatively high clock rate components and a low frequency circuit area such as used for standard peripheral circuit modules used for disk drives, video interfaces and the like. The interconnect module is positioned near an opening in a sheet metal bulkhead used as an electromagnetic interference (EMI) barrier around the main circuit area. The interface module uses a connector that is surrounded by one or more conductive shields that contain metal fingers on inboard and outboard sides to provide a ground connection between the interface module and the EMI barrier.

Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.

Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.

Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.

Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.