Patents by Inventor Colin Edie

Colin Edie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070164424
    Abstract: Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component.
    Type: Application
    Filed: March 31, 2004
    Publication date: July 19, 2007
    Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran, Ignatius Rasiah
  • Publication number: 20060040112
    Abstract: Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component.
    Type: Application
    Filed: July 15, 2003
    Publication date: February 23, 2006
    Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran
  • Patent number: 6579479
    Abstract: The invention includes a method of forming a plurality of spheres. A passageway is provided, and the passageway terminates in an orifice. A liquid is flowed through the passageway and expelled through the orifice to form drops. The drops are then passed through a fluid to cool and solidify the drops into a plurality of spheres. At least some of the spheres are collected. A pressure of the liquid is maintained within about ±10% of a value during the formation of the drops that are cooled into the collected spheres. The invention also includes a plurality of at least several hundred spheres having a diameter of less than about 0.05 inches and characterized by at least 95% of the spheres being within ±1.3% of a mean diameter of the spheres.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: June 17, 2003
    Assignee: Honeywell International Inc.
    Inventors: Colin Edie, David B. Keno, Christopher L. Parfeniuk