Abstract: A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.

Abstract: A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.

Abstract: A cross polarized electromagnetic interference shield apparatus for an electronic device having a Faraday cage made of two sets of planar conductive plates. Each of the two sets of planar conductive plates have parallel aligned elongated apertures which are not aligned in the same direction, and are spaced apart at a predetermined distance. This arrangement provides improved EMI attenuation and improved air flow over prior planar EMI shields, at a lower cost than prior honeycomb shields.