Abstract: An arrangement for transferring high frequency microwave signals between a cable and a microstrip printed circuit on a dielectric substrate is disclosed wherein a first microstrip track on a first substrate reactively couples with a second microstrip track on a second substrate, which second substrate is connected to an inner conductor of a coaxial cable and a ground plane associated with the first microstrip track is connected to the ground shielding of the coaxial cable. Since the microwave signals are reactively coupled by means of printed circuit tracks on a first dielectric substrate to printed circuit tracks on a second dielectric substrate, a non-contacting RF connection is established. This avoids the potential formation of intermodulation products which occur in metal--metal (galvanic) junctions. A further, advantage arises in that a d.c. block is automatically incorporated within the arrangement, reducing the need for separate coupled lines, capacitors and the like.