Patents by Inventor Colin M. Mcgraw

Colin M. Mcgraw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating panel with plating thickness-compensation structures
    Patent number: 6966976
    Abstract: An electroplating panel having a strip of components to be electroplated. The components are spaced apart from one another along an edge of the strip. The panel includes a main buss and a plating thickness-compensation structure electrically connecting the main buss to the components at the edge of the strip. The plating thickness-compensation structure includes a first buss member and a second buss member. The first buss member extends along the edge of the strip and electrically connected to each component. The second buss member is electrically connected to main buss. The plating thickness-compensation structure further includes one or more links electrically connecting the first and second buss members.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: November 22, 2005
    Assignee: Hutchinson Technology Incorporated
    Inventors: Colin M. Mcgraw, Andrew J. Peltoma