Patents by Inventor Colin O'Mara Hayes

Colin O'Mara Hayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11337309
    Abstract: Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: May 17, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Tina Aoude, David Fleming, Michelle Bowerman Riener, Colin O'Mara Hayes, Herong Lei, Robert K. Barr, David Louis Danza
  • Publication number: 20200296837
    Abstract: Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa·s to 100,000 Pa·s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa·s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Inventors: Tina Aoude, David Fleming, Michelle Bowerman Riener, Colin O'Mara Hayes, Herong Lei, Robert K. Barr, David Louis Danza