Patents by Inventor Colin P. McCann

Colin P. McCann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silica and silica-based slurry
    Patent number: 7279119
    Abstract: This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: October 9, 2007
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Stuart D. Hellring, Colin P. McCann, Suryadevara V. Babu, Yuzhuo Li, Satish Narayanan, Robert L. Auger
  • Silica and silica-based slurry
    Publication number: 20040067649
    Abstract: This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
    Type: Application
    Filed: July 28, 2003
    Publication date: April 8, 2004
    Inventors: Stuart D. Hellring, Colin P. McCann, Suryadevara V. Babu, Yuzhuo Li, Satish Narayanan, Robert L. Auger
  • Silica-based slurry
    Patent number: 6656241
    Abstract: This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization (“CMP”) of semiconductor and other microelectronic substrates.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: December 2, 2003
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Stuart D. Hellring, Colin P. McCann, Charles F. Kahle, Yuzhuo Li, Jason Keleher
  • Silica and a silica-based slurry
    Publication number: 20030094593
    Abstract: This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
    Type: Application
    Filed: June 14, 2001
    Publication date: May 22, 2003
    Inventors: Stuart D. Hellring, Colin P. McCann, Suryadevara V. Babu, Yuzhuo Li, Satish Narayanan