Patents by Inventor Colin Soul

Colin Soul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency (RF) circuit board topology
    Patent number: 7154356
    Abstract: An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: December 26, 2006
    Assignee: BelAir Networks Inc.
    Inventors: Gilbert P. Brunette, Eric Johnson, Stephen G. Rayment, Colin Soul
  • Novel radio frequency (RF) circuit board topology
    Publication number: 20060125573
    Abstract: An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board.
    Type: Application
    Filed: February 9, 2006
    Publication date: June 15, 2006
    Inventors: Gilbert Brunette, Eric Johnson, Stephen Rayment, Colin Soul
  • Radio frequency (RF) circuit board topology
    Patent number: 7030712
    Abstract: An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: April 18, 2006
    Assignee: BelAir Networks Inc.
    Inventors: Gilbert P. Brunette, Eric Johnson, Stephen G. Rayment, Colin Soul
  • Novel radio frequency (RF) circuit board topology
    Publication number: 20050190614
    Abstract: An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board.
    Type: Application
    Filed: March 1, 2004
    Publication date: September 1, 2005
    Inventors: Gilbert Brunette, Eric Johnson, Stephen Rayment, Colin Soul