Patents by Inventor Colin Xingcun Tong

Colin Xingcun Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal interconnect and interface materials, methods of production and uses thereof
    Publication number: 20080023665
    Abstract: Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
    Type: Application
    Filed: July 25, 2006
    Publication date: January 31, 2008
    Inventors: Martin W. Weiser, Ravi Rastogi, Meghana Nerurkar, Devesh Mathur, Colin Xingcun Tong