Abstract: Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell are coupled to first charge sides of other cells, and such that second charge sides of each cell are coupled to second charge sides of other cells. Cells and/or cell systems is connected to other cells and/or cell systems to form battery systems by layering cells such that a first charge side of a cell are coupled to second charge side of another cell. In this manner the number of electrically insulating separators is reduced, thereby also reducing weight and volume of resulting systems.

Abstract: Direct fabrication of three-dimensional metal parts by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal powder can contain an elemental metal or several metals, the vehicle can be an organic resin or an amalgam, and the irradiation can be selectively applied by a YAG laser.

Abstract: An improved method for inhibiting tin whisker growth involving the implantation in a tin coating of an ion or ions selected from the group Pb, Bi, Sb, Tl, Cu, Ag, Au, Cd, Mo, Cr, W, Ar, He, Ne and Kr.

Abstract: Three-dimensional metal parts are fabricated by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal powder can contain an elemental metal or several metals, the vehicle can be an organic resin or an amalgam, and the irradiation can be selectively applied by a YAG laser.

Abstract: A method of depositing micron-sized metal lines on a dielectric substrate, such as polyimide. The dielectric is covered with a thin metallic layer, of a first metal placed in a reaction cell containing a gas-phase molecular species containing a second metal, and exposed to a focused laser beam. A translation stage moves the dielectric relative to the beam to selectively deposit micron-sized second metal lines on the metallic layer. The metallic layer on the unirradiated portion of the substrate is subsequently etched away, leaving the lines adhered to the dielectric surface.

Abstract: A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.

Abstract: Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.

Abstract: Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles so that each bonded particle is between and in contact with a pad and a lead. Preferably the particles are solid spheres 1.0 mils in diameter. The spheres may be applied by covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of vehicle and spheres.

Abstract: A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and particulate solid constituents which is non-solidifying, conformable, compliant, is removable, provides containment to impulsive loading, and is simple to apply.

Abstract: An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.

Abstract: A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a coating alloy containing the metal of the second electrical member and a coupling material that is well absorbent of laser energy at the laser beam wavelength, has a lower melting point than either of the electrical members, and has a low solubility in a solid bond alloy of the electrical members. The laser characteristics are selected so that as bonding occurs a bond alloy of the electrical members solidifies and a solidification front drives the molten coupling material away from the bond interface toward the exterior periphery of the bond, so that substantially all of the solidified bond interface and bond interface strength results from the bond alloy. Coating a copper lead with a coating alloy containing gold and a coupling material, and then contacting the coated copper lead with a gold bonding pad provides for gold-to-gold TAB tape laser bonding.

Abstract: A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a material that is well absorbent of laser energy at the laser beam wavelength, has a lower melting point than either the first or second electrical members, and has a low solubility in a solid alloy of the electrical members. The laser characteristics are selected so that as bonding occurs an alloy of the electrical members solidifies and a solidification front drives the molten coating and molten compounds containing the coating away from the bond interface towards the exterior periphery of the bond, and substantially all of the solidified bond interface consists of an alloy of the first and second members. The coating can also aid in wetting the bond interface. In one example a copper electrical member coated with tin is bonded to a gold electrical member using a pulsed YAG laser with a beam diameter of 0.002 inches, a wavelength of 1.

Abstract: Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles. Preferably the particles are solid spheres and may be applied in various ways such as covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of adhesive and spheres. The method is particularly well suited for flip chip bonding.

Abstract: A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositiong electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

Abstract: A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive material enclose the bottom and tops of the elongate members and form a plurality of liquid coolant passageways between the elongate members within the layers. The elongate members may be solid cylinders or tubes. A plurality of microcapillaries may be formed in the bottom layer to provide additional thermocoupling, adhesion, and detachability.

Abstract: A method of making a flexible interconnect for connection between stacks of electronic components. The method includes punching a plurality of holes through a flexible insulating material, plating copper studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the plated studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.

Abstract: A controlled volume of a liquid metal is dispensed from a ceramic capillary tube. A wetted film of the liquid metal is applied to the tip of the tube and the liquid metal is inserted into the interior of the tube. The tube contacts a receiving surface with the wetted film and ultrasonic energy is applied to the tube to dispense a small control volume with extreme precision.