Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: The described embodiments relate to methods and apparatus for increasing rigidity of a metal housing while maintaining or reducing a wall thickness of the metal housing. More particularly a method for embedding a stiffener layer within an aluminum substrate is discussed. In one exemplary embodiment the stiffener layer can be a carbon fiber sheet applied to an inside surface of an unfinished housing and then subsequently covered by depositing a layer of aluminum over the carbon fiber in a solid-state deposition process. The deposited aluminum can adhere to the unfinished housing around or through the carbon fiber layer to bond with the unfinished housing. Deposition parameters can be controlled to prevent damage to the carbon fiber sheet.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: Unitary structures having conductive portions electrically separated by non-conductive portions are described. In some embodiments, the non-conductive portions are made of metal oxide. In some embodiments, the method involves an oxidizing process adapted to convert an entire thickness at a selected portion of a metal substrate to a metal oxide, thereby creating metal portions that are electrically isolated from one another. In some embodiments, the thickness of the metal substrate is reduced at certain regions prior to oxidizing in order to provide a sufficiently thin metal for complete oxidization through the entire thickness. In some embodiments, the oxidizing process involves a plasma electrolytic oxidation process. In some embodiments, the plasma is concentrated at certain regions of the substrate for preferential oxidation. Applications for the substrate include enclosures and electrical components for electronic devices that use radio frequency communication.

Abstract: The described embodiments relate generally to methods for enhancing cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line with a cosmetic surface portion of the friction stir processed parts. In some embodiments cold spray can be used to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

Abstract: A method for manufacturing an enclosure for an electronic device using laser texturing to create a first surface having different surface characteristics than a second surface adjacent to the first surface.

Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic join between various parts.

Abstract: The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.

Abstract: Unitary structures having conductive portions electrically separated by non-conductive portions are described. In some embodiments, the non-conductive portions are made of metal oxide. In some embodiments, the method involves an oxidizing process adapted to convert an entire thickness at a selected portion of a metal substrate to a metal oxide, thereby creating metal portions that are electrically isolated from one another. In some embodiments, the thickness of the metal substrate is reduced at certain regions prior to oxidizing in order to provide a sufficiently thin metal for complete oxidization through the entire thickness. In some embodiments, the oxidizing process involves a plasma electrolytic oxidation process. In some embodiments, the plasma is concentrated at certain regions of the substrate for preferential oxidation. Applications for the substrate include enclosures and electrical components for electronic devices that use radio frequency communication.

Abstract: A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

Abstract: The described embodiments relate to methods and apparatus for increasing rigidity of a metal housing while maintaining or reducing a wall thickness of the metal housing. More particularly a method for embedding a stiffener layer within an aluminum substrate is discussed. In one exemplary embodiment the stiffener layer can be a carbon fiber sheet applied to an inside surface of an unfinished housing and then subsequently covered by depositing a layer of aluminum over the carbon fiber in a solid-state deposition process. The deposited aluminum can adhere to the unfinished housing around or through the carbon fiber layer to bond with the unfinished housing. Deposition parameters can be controlled to prevent damage to the carbon fiber sheet.

Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.