Abstract: Apparatus and techniques described herein can be used to provide a bipolar battery plate with lower resistance as compared to other approaches. In an example, a bipolar plate comprises a conductive current collector substrate with lead-containing surfaces on both sides, onto which active materials are applied. Interfaces with low contact resistance can be created between the active materials and the current collector substrate by a combination of mechanical, thermochemical, and electrochemical techniques. Specifically, the present subject matter can include a bipolar plate fabricated by applying “wet,” (e.g., uncured) active materials to the current collector, and performing a curing procedure such that a corrosion layer with low contact resistance is formed between the active materials and the underlying surfaces of the current collector.

Abstract: A conductive current collector with modified surfaces can be included as a portion of a bipolar battery assembly. The fabrication process can include deposition or formation of a thin film layer such as metal silicide on a surface of the current collector. Metal silicides can be created by co-sputtering or by annealing after deposition of one or more of a silicon or a metal layer. Additional layers can be provided, such as to facilitate adhesion of an active material to a current collector.

Abstract: Apparatus and techniques such as can include a sealed bipolar battery assembly are described herein. For example, the battery assembly can using two or more sealing techniques, such as to provide a liquid-tight assembly. A sealed current collector assembly can be provided, such as by fitting compressible plastic seals to one or both side of a current collector. An adhesive seal can be applied to an edge or perimeter of the current collector. A plastic seal assembly can be used to anchor the seals or to provide an additional layer of leakage protection should electrolyte seep under hydrophobic plastic seals. Current collector assemblies including stackable casing frames can be assembled to provide a rigid casing. These casing assemblies can be stacked on top of one another to form bipolar cells comprising the battery assembly.

Abstract: A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.

Abstract: Apparatus and techniques are described herein for providing a battery plate assembly including a silicon current collector. The silicon current collector can include apertures. A lead layer or lead alloy layer can be formed on the silicon current collector. A monopolar battery assembly can be provided, such as including monopolar battery plate assemblies comprising silicon current collectors. The silicon can include a conductive metallurgical grade silicon, such as cast and cut to provide individual current collector substrates.

Abstract: An end contact, such as for a bipolar battery assembly, can be sized and shaped to provide a low resistance electrical bond between the battery cells and a terminal. In an example, a bipolar battery assembly can include a casing, at least one bipolar current collector housed within the casing, a first monopolar current collector, a first electrolyte region defined between the bipolar current collector and the monopolar current collector, and a first electrically-conductive end contact electrically coupled to the first monopolar current collector. The first electrically-conductive end contact can include a centrally-located hub region, a plurality of planar arms extending radially outward from a centrally-located hub region, and at least one planar brace comprising a first segment extending between two planar arms amongst the plurality of planar arms. A similar end contact can be used for opposite end of the battery assembly.

Abstract: Apparatus and techniques are described herein for providing a plate such as can be included as a portion of a hybrid energy storage device assembly. A hybrid device can include capacitor and battery structures, such as can include a sealed stack of hybrid bipolar plates comprising silicon wafers.

Abstract: Apparatus and techniques herein related battery plates. For example, a first battery plate can include a conductive silicon wafer. A first mechanical support can be located on a first side of the conductive silicon wafer. A first active material can be adhered to the first mechanical support and the first side of the conductive silicon wafer, the first active material having a first polarity. In an example, the battery plate can be a bipolar plate, such as having a second mechanical support located on a second side of the conductive silicon wafer opposite the first side, and a second active material adhered to the second mechanical support and the second side of the conductive silicon wafer, the second material having an opposite second polarity.

Abstract: A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.

Abstract: Apparatus and techniques are described herein for providing a bipolar battery plate such as can be included as a portion of an energy storage device assembly, such as a battery. The bipolar battery plate can include a silicon substrate. A first metal layer can be deposited on a first surface of the rigid silicon substrate, and a different second metal layer can be deposited on a second surface of the rigid silicon substrate opposite the first surface. The first and second metal layers can be annealed to form a first silicide on the first surface and a different second silicide on the second surface of the rigid silicon substrate.

Abstract: Apparatus and techniques herein related battery plates. For example, a first battery plate can include a conductive silicon wafer. A first mechanical support can be located on a first side of the conductive silicon wafer. A first active material can be adhered to the first mechanical support and the first side of the conductive silicon wafer, the first active material having a first polarity. In an example, the battery plate can be a bipolar plate, such as having a second mechanical support located on a second side of the conductive silicon wafer opposite the first side, and a second active material adhered to the second mechanical support and the second side of the conductive silicon wafer, the second material having an opposite second polarity.

Abstract: Apparatus and techniques are described herein for providing a battery plate assembly including a silicon current collector. The silicon current collector can include apertures. A lead layer or lead alloy layer can be formed on the silicon current collector. A monopolar battery assembly can be provided, such as including monopolar battery plate assemblies comprising silicon current collectors. The silicon can include a conductive metallurgical grade silicon, such as cast and cut to provide individual current collector substrates.

Abstract: Apparatus and techniques are described herein for providing a bipolar battery plate such as can be included as a portion of an energy storage device assembly, such as a battery. The bipolar battery plate can include a silicon substrate. A first metal layer can be deposited on a first surface of the rigid silicon substrate, and a different second metal layer can be deposited on a second surface of the rigid silicon substrate opposite the first surface. The first and second metal layers can be annealed to form a first silicide on the first surface and a different second silicide on the second surface of the rigid silicon substrate.

Abstract: Apparatus and techniques such as can include a sealed bipolar battery assembly are described herein. For example, the battery assembly can using two or more sealing techniques, such as to provide a liquid-tight assembly. A sealed current collector assembly can be provided, such as by fitting compressible plastic seals to one or both side of a current collector. An adhesive seal can be applied to an edge or perimeter of the current collector. A plastic seal assembly can be used to anchor the seals or to provide an additional layer of leakage protection should electrolyte seep under hydrophobic plastic seals. Current collector assemblies including stackable casing frames can be assembled to provide a rigid casing. These casing assemblies can be stacked on top of one another to form bipolar cells comprising the battery assembly.

Abstract: Apparatus and techniques are described herein for providing a plate such as can be included as a portion of a hybrid energy storage device assembly. A hybrid device can include capacitor and battery structures, such as can include a sealed stack of hybrid bipolar plates comprising silicon wafers.