Abstract: Provided is a process, medium, or system including using block chain as a distributed routing environment for contract based handoff to route streaming data to edge-based data centers.

Abstract: Provided is a modular datacenter having a moveable rack assembly configured to selectively provide access to rack-mounted computing devices, with access barriers selectively providing access to rack-mounted computing devices within an exposed rack or portion of a rack or device mounted thereon, safety interlocks controlling when the rack assembly moves, and space-efficient thermal management systems.

Abstract: Provided is a rack, comprising: a plurality of rack units; and a plurality of lockers each housing a different respective subset of the rack units, wherein respective lockers among the plurality comprise: a first respective barrier disposed between a respective pair of the rack units; a second respective barrier disposed between another respective pair of the rack units; a third respective barrier that is orthogonal to the first barrier and the second barrier, the third respective barrier being moveably or removeably coupled to the rack; a respective volume configured to receive one or more computing devices; and a respective lock configured to secure the third respective barrier to the rack in the closed position when in a locked state.

Abstract: Provided is a QSFP+ patch panel, comprising: a circuit board; a plurality of pairs of QSFP+ sockets connected to one another via conductive traces of the circuit board; and one or more microcontrollers coupled to at least two of the conductive traces of each pair of QSFP+ sockets. The one or more microcontrollers comprise memory storing instructions that when executed cause the one or more microcontrollers to perform operations comprising: obtaining configuration settings for the QSFP+ sockets; and configuring connections of the QSFP+ sockets based on the configuration settings.

Abstract: Provided is a process including: receiving, with a given rack computing unit, direct current (DC) power via a DC bus connected to a plurality of rack computing units of a rack and configured to deliver DC power to the plurality of rack computing units; determining that a duration of time designated for the given rack computing unit to access the DC power bus for transmission is occurring; in response to the determination, applying a time-varying electrical stimulus to the DC power bus, wherein the time-varying electrical stimulus encodes an address on the DC power bus of a rack controller and a sensor measurement indicative of operation of the given rack computing unit; and concurrent with applying the time-varying electrical stimulus, filtering voltage fluctuations of the DC power bus resulting from the time-varying electrical stimulus to produce electrical power used by the given rack computing unit.

Abstract: Provided is a process, medium, or system including using block chain as a distributed routing environment for contract based handoff to route streaming data to edge-based data centers.

Abstract: Provided is a QSFP+ patch panel, comprising: a circuit board; a plurality of pairs of QSFP+ sockets connected to one another via conductive traces of the circuit board; and one or more microcontrollers coupled to at least two of the conductive traces of each pair of QSFP+ sockets. The one or more microcontrollers comprise memory storing instructions that when executed cause the one or more microcontrollers to perform operations comprising: obtaining configuration settings for the QSFP+ sockets; and configuring connections of the QSFP+ sockets based on the configuration settings.

Abstract: Provided is a base for a server rack, the base comprising a first arm extending in a first direction; a second arm extending in a second direction, different from the first direction, the first arm and second arm each having a bottom configured to face a floor and a top configured to face toward rack-mounted computing equipment; a plurality of height-adjustable stands extending from the bottom of the first arm and the second arm; and a plurality of ball-bearings extending from the top of the first arm and the second arm.

Abstract: Provided is a process for cooling a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices, the process including: directing a cooling fluid, at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure; and directing the cooling fluid upward to exit the interior chamber.

Abstract: Provided is a process for cooling a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices, the process including: directing a cooling fluid, at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure; and directing the cooling fluid upward to exit the interior chamber.

Abstract: Provided is an external secondary computing device configured to monitor or control a rack-mounted computing device independently of whether the rack-mounted computing device is operating or is turned off via a low-pin-count motherboard bus independently of a baseboard management controller.

Abstract: Provided is a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices. The datacenter chamber comprises three or more racks, each rack having a plurality of receptacles configured to hold a computing device; a chassis configured to secure each of the racks in spaced relation relative to one another, wherein the chassis is configured to secure the racks facing outward from an interior chamber defined by a back-side of the racks, and wherein the chassis is configured to position the racks facing at least three different directions; and an integrated cooling system configured to drive a cooling fluid along computing devices mounted in the racks and through the interior chamber.

Abstract: Provided is a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices. The datacenter chamber comprises three or more racks, each rack having a plurality of receptacles configured to hold a computing device; a chassis configured to secure each of the racks in spaced relation relative to one another, wherein the chassis is configured to secure the racks facing outward from an interior chamber defined by a back-side of the racks, and wherein the chassis is configured to position the racks facing at least three different directions; and an integrated cooling system configured to drive a cooling fluid along computing devices mounted in the racks and through the interior chamber.

Abstract: Provided is a base for a server rack, the base comprising a first arm extending in a first direction; a second arm extending in a second direction, different from the first direction, the first arm and second arm each having a bottom configured to face a floor and a top configured to face toward rack-mounted computing equipment; a plurality of height-adjustable stands extending from the bottom of the first arm and the second arm; and a plurality of ball-bearings extending from the top of the first arm and the second arm.

Abstract: Provided is a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices. The datacenter chamber comprises three or more racks, each rack having a plurality of receptacles configured to hold a computing device; a chassis configured to secure each of the racks in spaced relation relative to one another, wherein the chassis is configured to secure the racks facing outward from an interior chamber defined by a back-side of the racks, and wherein the chassis is configured to position the racks facing at least three different directions; and an integrated cooling system configured to drive a cooling fluid along computing devices mounted in the racks and through the interior chamber.

Abstract: Provided is a process including: receiving, with a given rack computing unit, direct current (DC) power via a DC bus connected to a plurality of rack computing units of a rack and configured to deliver DC power to the plurality of rack computing units; determining that a duration of time designated for the given rack computing unit to access the DC power bus for transmission is occurring; in response to the determination, applying a time-varying electrical stimulus to the DC power bus, wherein the time-varying electrical stimulus encodes an address on the DC power bus of a rack controller and a sensor measurement indicative of operation of the given rack computing unit; and concurrent with applying the time-varying electrical stimulus, filtering voltage fluctuations of the DC power bus resulting from the time-varying electrical stimulus to produce electrical power used by the given rack computing unit.

Abstract: Provided is a QSFP+ patch panel, comprising: a circuit board; a plurality of pairs of QSFP+ sockets connected to one another via conductive traces of the circuit board; and one or more microcontrollers coupled to at least two of the conductive traces of each pair of QSFP+ sockets. The one or more microcontrollers comprise memory storing instructions that when executed cause the one or more microcontrollers to perform operations comprising: obtaining configuration settings for the QSFP+ sockets; and configuring connections of the QSFP+ sockets based on the configuration settings.

Abstract: Provided is a process for cooling a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices, the process including: directing a cooling fluid, at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure; and directing the cooling fluid upward to exit the interior chamber.