Patents by Inventor Cong-Binh Do

Cong-Binh Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal shield for maintaining a generally constant temperature
    Patent number: 10773879
    Abstract: A thermal shield comprises an insulation layer having a space defined therein, wherein a low-conductivity material fills the space, and a valve configured to connect to a vacuum to remove air from the space, thereby increasing insulating properties of the insulation layer.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 15, 2020
    Assignee: SUNWELL ENGINEERING COMPANY LIMITED
    Inventors: Vladimir Goldstein, Cory Rosa, Cong-Binh Do
  • THERMAL SHIELD FOR MAINTAINING A GENERALLY CONSTANT TEMPERATURE
    Publication number: 20190031431
    Abstract: A thermal shield comprises an insulation layer having a space defined therein, wherein a low-conductivity material fills the space, and a valve configured to connect to a vacuum to remove air from the space, thereby increasing insulating properties of the insulation layer.
    Type: Application
    Filed: September 28, 2018
    Publication date: January 31, 2019
    Inventors: Vladimir Goldstein, Rosa Corey, Cong-Binh Do
  • Multilayer thermal shield comprising an integrated fluid circuit
    Patent number: 10093078
    Abstract: When products to be shipped are temperature-sensitive, it is necessary to maintain a substantially uniform and constant temperature to avoid spoilage. As a result, thermal shields are often placed on top of the products. Many designs for thermal shields have been considered in the past but improvements are still desired. Accordingly, there is provided a multilayer thermal shield (100) comprising a thermally conductive layer (108), and at least one heat exchange fluid circuit (120) coupled to a first surface of the thermally conductive layer, the at least one heat exchange fluid circuit comprising at least one inlet (124) configured to permit the ingress of heat exchange fluid. The thermal shield further comprises an outer insulation layer (104) connected to a first surface of the thermally conductive layer (108) and comprising grooves designed to receive the heat exchange fluid circuit.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: October 9, 2018
    Assignee: SUNWELL ENGINEERING COMPANY LIMITED
    Inventors: Vladimir Goldstein, Rosa Corey, Cong-Binh Do