Abstract: An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Abstract: A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

Abstract: A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Abstract: A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

Abstract: An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Abstract: A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Abstract: A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

Abstract: A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

Abstract: Examples of the present disclosure may include methods, systems, and computer readable media with executable instructions. An example method for determining document structure similarity can include segmenting path sequences (206) of Document Object Model (DOM) trees (120, 462) from a number of web pages (202) into B components (561). Path signals (210) corresponding to the path sequences (206) are determined based on a count of the occurrences of particular paths in the Bthe component (571), and unique path signals (210) are transformed into discrete wavelet signals (214)(572). The discrete wavelet signals (214) are analyzed at multiple DOM tree resolution levels (573).

Abstract: Examples of the present disclosure may include methods, systems, and computer readable media with executable instructions. An example method for determining document structure similarity can include segmenting path sequences (206) of Document Object Model (DOM) trees (120, 462) from a number of web pages (202) into B components (561). Path signals (210) corresponding to the path sequences (206) are determined based on a count of the occurrences of particular paths in the Bth component (571), and unique path signals (210) are transformed into discrete wavelet signals (214)(572). The discrete wavelet signals (214) are analyzed at multiple DOM tree resolution levels (573).

Abstract: Systems and methods for seed set expansion are provided. A context-based extractor (22) generates a set of context-based candidate members of a seed set from a set of web pages associated with an organization as words connected with a seed set member by a contextual pattern and a context confidence value for each candidate member. A list-based extractor (24) generates a set of list-based candidate members from elements within a plurality of lists in the set of web pages and a list confidence value associated with each candidate member. A confidence arbitrator (26) determines an intersection set of candidate members present in both sets of candidate members and determines a final confidence value for each of the intersection set of candidate members based on their respective context confidence value and list confidence value. A candidate selector (28) selects a candidate member for inclusion in a seed set (21).

Abstract: Presented is a method of extracting named entities from a large-scale document corpus. The method includes identifying named entities in the corpus and forming a set of seed entities manually or automatically using some existing resources, constructing a named entity graph to discover same-type probability between any given pair of named entities, expanding the set of seed entities and performing a confidence propagation of the seed entities on the named entity graph.

Abstract: Disclosed is a method of generating a model representation of product information. The method obtains a list of products from a source of product information. A hierarchical tree is then constructed from the obtained list of products, wherein each hierarchical layer of the tree corresponds to a different category of product information.