Abstract: An information transmission method and a related device applied to a cloud service system are provided. The cloud service system includes an arbiter, a first switch, and a first server group. The arbiter is connected to the first server group by using the first switch. The method includes: a first server obtains a first identifier of the first server in the first server group. The first server determines, in a first slot, a first time domain location corresponding to the first identifier. The first time domain location is a time domain location at which the first switch receives a first request to be processed by the arbiter, and different identifiers correspond to different time domain locations in the first slot. The first server sends the first request to the first switch based on the first time domain location.

Abstract: An information transmission method and a related device applied to a cloud service system are provided. The cloud service system includes an arbiter, a first switch, and a first server group. The arbiter is connected to the first server group by using the first switch. The method includes: a first server obtains a first identifier of the first server in the first server group. The first server determines, in a first slot, a first time domain location corresponding to the first identifier. The first time domain location is a time domain location at which the first switch receives a first request to be processed by the arbiter, and different identifiers correspond to different time domain locations in the first slot. The first server sends the first request to the first switch based on the first time domain location.

Abstract: Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.

Abstract: Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.

Abstract: A method and device for controlling an electronic lock are disclosed. The electronic lock includes a lock catch and a lock body that includes a first lock hook and a second lock hook. The first lock hook has a first lock hook locking position where it is engaged with the lock catch and a first lock hook unlocking position where it is separated from the lock catch. The second lock hook has a second lock hook locking position where it locks the first lock hook in the first lock hook locking position and a second lock hook unlocking position where it is separated from the first lock hook. The method includes: detecting whether a locking operation occurs; and when detecting a locking operation, controlling at least one of the first lock hook and the second lock hook to vibrate, allowing the second lock hook to lock the first lock hook in the first lock hook locking position or to be separated from the first lock hook.

Abstract: A method and device for controlling an electronic lock are disclosed. The electronic lock includes a lock catch and a lock body that includes a first lock hook and a second lock hook. The first lock hook has a first lock hook locking position where it is engaged with the lock catch and a first lock hook unlocking position where it is separated from the lock catch. The second lock hook has a second lock hook locking position where it locks the first lock hook in the first lock hook locking position and a second lock hook unlocking position where it is separated from the first lock hook. The method includes: detecting whether a locking operation occurs; and when detecting a locking operation, controlling at least one of the first lock hook and the second lock hook to vibrate, allowing the second lock hook to lock the first lock hook in the first lock hook locking position or to be separated from the first lock hook.