Patents by Inventor Cong N. Duong

Cong N. Duong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assessing structural repair integrity
    Patent number: 8581736
    Abstract: A strain measurement device to assess the integrity of a structural repair to a surface comprises a detector, a processor, and a memory module coupled to the processor. The memory module comprises logic instructions stored in a computer readable medium which, when executed by the processor, configure the processor to use the detector to obtain a first strain measurement from an external strain indicator, use the detector to obtain a second strain measurement from the measurement sensor after at least one stress test is applied to the structural repair, and generate a signal when a difference between the first strain measurement and the second strain measurement exceeds a threshold.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: November 12, 2013
    Assignee: The Boeing Company
    Inventors: Keith L. McIver, Aristidis Sidiropoulos, Russell L. Keller, Cong N. Duong
  • ASSESSING STRUCTURAL REPAIR INTEGRITY
    Publication number: 20110316712
    Abstract: A strain measurement device to assess the integrity of a structural repair to a surface comprises a detector, a processor, and a memory module coupled to the processor. The memory module comprises logic instructions stored in a computer readable medium which, when executed by the processor, configure the processor to use the detector to obtain a first strain measurement from an external strain indicator, use the detector to obtain a second strain measurement from the measurement sensor after at least one stress test is applied to the structural repair, and generate a signal when a difference between the first strain measurement and the second strain measurement exceeds a threshold.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 29, 2011
    Inventors: KEITH L. MCIVER, Aristidis Sidiropoulos, Russell L. Keller, Cong N. Duong