Patents by Inventor Cong Wei

Cong Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070046
    Abstract: An integrated circuit includes a semiconductor substrate, an interconnection structure, a first dielectric layer, conductive pads, a second dielectric layer, conductive connectors, and an anti-stress layer. The interconnection structure is disposed on the semiconductor substrate. The first dielectric layer is disposed on the interconnection structure. The conductive pads are disposed on the first dielectric layer and are electrically connected to the interconnection structure. The second dielectric layer is disposed on the first dielectric layer to laterally surround the conductive pads. The conductive connectors are disposed on and electrically connected to the conductive pads. The anti-stress layer is disposed over the conductive pads and laterally surrounds some of the conductive connectors.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cong-Wei Yang, Yu Chen Lee, Chin-Hua Wang, Shin-Puu Jeng
  • Publication number: 20250062176
    Abstract: A device structure includes: an interposer including interposer dielectric material layers having formed therein interposer metal interconnect structures and die-side interposer bonding pads; at least one semiconductor die having formed therein in-die bonding pads that are bonded to a respective one of the die-side interposer bonding pads by metal-to-metal bonding; and a composite die frame laterally surrounding the at least one semiconductor die. The composite die frame includes a molding compound die frame portion including a molding compound material and frame edge reinforcement structures located at corners of the composite die frame and including a material having a lower coefficient of thermal expansion at 20 degrees Celsius than the molding compound material.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 20, 2025
    Inventors: Chin-Hua Wang, Tsung-Yen Lee, Cong-Wei Yang, Shin-Puu Jeng
  • Publication number: 20240388074
    Abstract: A wall mountable backplate for securing an electro vehicle service equipment, EVSE, to a wall is provided. The wall mountable backplate includes a housing having one or more openings for guiding one or more cables into the housing. The housing is configured for receiving an electrical connector having a plurality of electrical contacts for connecting a plurality of corresponding electrical contacts of the EVSE. The housing has one or more positioning elements for mating with corresponding positioning elements of the EVSE. Further, the housing has one or more mounting elements for either mounting a front cover for providing an enclosed environmentally protected interior volume or mounting the EVSE to the housing.
    Type: Application
    Filed: May 14, 2024
    Publication date: November 21, 2024
    Inventors: Vincent-Cong WEI, Sven-Yushan Qi, Pan Chen
  • Publication number: 20240362902
    Abstract: Vision Transformers (ViT) have shown their competitive advantages performance-wise compared to convolutional neural networks (CNNs) though they often come with high computational costs. Methods, systems and techniques herein learn instance-dependent attention patterns, utilizing a lightweight connectivity predictor module to estimate a connectivity score of each pair of tokens. Intuitively, two tokens have high connectivity scores if the features are considered relevant either spatially or semantically. As each token only attends to a small number of other tokens, the binarized connectivity masks are often very sparse by nature providing an opportunity to accelerate the network via sparse computations. Equipped with the learned unstructured attention pattern, sparse attention ViT produces a superior Pareto-optimal trade-off between FLOPs and top-1 accuracy on ImageNet compared to token sparsity (48%˜69% FLOPs reduction of MHSA; accuracy drop within 0.4%).
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Applicant: ModiFace Inc.
    Inventors: Cong WEI, Brendan DUKE, Ruowei JIANG
  • Publication number: 20240249958
    Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
  • Publication number: 20240198839
    Abstract: A computer-implemented method for method for electric vehicle charging access control includes a charging station for electric vehicles that detects presence of an electric vehicle available for establishing a wireless data connection, establishes a wireless data connection with the electric vehicle, receives, via the wireless data connection, identification data identifying the electric vehicle, and authorizes the charging of the electric vehicle in response to determining that the electric vehicle is registered as eligible for using the charging station based on the identification data.
    Type: Application
    Filed: December 19, 2023
    Publication date: June 20, 2024
    Applicant: ABB E-mobility B.V.
    Inventors: Vincent-Cong Wei, Pan Chen, Sven Qi
  • Publication number: 20240140222
    Abstract: The present disclosure relates to a socket with a fixing device and a charging cabinet for electric vehicles with the socket. The fixing device includes a connection mechanism, which is provided on one side of a mainbody of the socket and is adapted to releasably connect the socket to a mounting object to which the socket is to be mounted by means of a first fixing member, and a pivot mechanism, which is provided between the other side of the mainbody opposite to the connection mechanism and the mounting object, so that the socket is pivotable relative to the mounting object when released from the mounting object. Through the fixing device for the electric vehicle charging gun socket, the charging gun socket can be easily and quickly fixed on a mounting object, such as a charging cabinet, since the number of required fixing parts is reduced.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Pan CHEN, Vincent-Cong WEI, Sven QI, Xiao Fei XIE
  • Patent number: 11934235
    Abstract: A server includes a chassis and a storage module. The storage module is disposed in the chassis. The storage module includes a base, a first electrical connector, a storage device, a connecting member and a first fixing member. A first side of the base has a first fixing portion. The first electrical connector is disposed at a second side of the base, wherein the second side is opposite to the first side. The storage device has a second electrical connector. The connecting member is connected to the storage device. The first fixing member is disposed on the connecting member. The second electrical connector is connected to the first electrical connector and the first fixing member is fixed to the first fixing portion, so as to fix the storage device on the base.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: March 19, 2024
    Assignee: Wiwynn Corporation
    Inventors: Shih-Hung Chen, Cong-Wei Yang
  • Publication number: 20240069610
    Abstract: A server includes a chassis and a storage module. The storage module is disposed in the chassis. The storage module includes a base, a first electrical connector, a storage device, a connecting member and a first fixing member. A first side of the base has a first fixing portion. The first electrical connector is disposed at a second side of the base, wherein the second side is opposite to the first side. The storage device has a second electrical connector. The connecting member is connected to the storage device. The first fixing member is disposed on the connecting member. The second electrical connector is connected to the first electrical connector and the first fixing member is fixed to the first fixing portion, so as to fix the storage device on the base.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 29, 2024
    Applicant: Wiwynn Corporation
    Inventors: Shih-Hung Chen, Cong-Wei Yang
  • Publication number: 20240034179
    Abstract: A system and method for an electric vehicle fueling system (EVFS) includes an AC grid input receiving AC power from an electric grid; a main control chip controlling the EVFS to perform a charge session of an electric vehicle; a power module supplying the main control chip with power; a power loss detection module providing a power loss signal when the AC power is unavailable; wherein the power module comprises a super capacitor storing an auxiliary supply power that is supplied to the main control chip; wherein, when the main control chip receives the power loss signal, the main control chip saves session information of the charging session; and wherein the session information comprises information needed to continue or complete the charging session.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 1, 2024
    Applicant: ABB E-mobility B.V.
    Inventors: Pan Chen, Vincent-Cong Wei, Sven Qi
  • Patent number: 10580096
    Abstract: The invention relates to a method for determining an integrated network loss rate in the UHV AC cross-regional electricity trading. The method includes fitting a curve relationship between integrated network loss rates and transmitting powers on the basis of theoretical calculations of the UHV AC transmission line loss, using a relational fitted curve between actual values of integrated network loss rates and transmitting powers calculated according to gateway power statistical data to perform geometrical average correction on the original curve, and making planned values of the integrated network loss rates to be closer to the actual values according to a method for determining UHV AC integrated network loss rates according to a correction curve function relation, which greatly increases fairness of the trading settlement. The method is simple and easy to implement with high accuracy, and applicable to planning and trading settlement of regular or real-time UHV AC electricity trading.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: March 3, 2020
    Assignees: STATE GRID CORPORATION OF CHINA ECONOMIC & TECHNOLOGY RESEARCH, INSTITUTE OF HUBEI ELECTRIC POWER COMPANY
    Inventors: Ting Hu, Yinya Zhang, Dongjun Yang, Shunming Bai, Jingyou Xu, Daqiang Xiao, Cong Wei
  • Patent number: 10379234
    Abstract: A gamma-ray analysis system is described for analyzing gamma-ray emitting radionuclides. The gamma-ray analysis system includes an analytical apparatus having a gamma-ray detector in operative communication with a modular and scalable shield assembly that encases a sample container having a sample to be tested. The detector communicates data to an electronic interface device that converts the data from an analog format to a digital format before a controller transmits the data to a central laboratory for further data processing, analysis and conclusion by qualified laboratory analysts. The controller runs an application software package on a graphic user interface that allows simple steps for conducting testing and data acquisition by the end user, while permitting real time data transmission between the field site and the central location. Functions were implemented for ensuring laboratory quality results while removing knowledge and experience requirements of an end user.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 13, 2019
    Assignees: THE UNITED STATES OF AMERICA, as represented by the Secretary, Department of Health and Human Services, Mirion Technologies, Inc., Mirion Technologies (Canberra UK) Limited
    Inventors: Cong Wei, Kelly M. Garnick, Thomas A. Scott, Elon M. Malkin, Jennifer T. Szymanski, Steve Laskos, James Cocks, Jeffrey Raimondi, Richard Mowry, Hiram Gonzalez, Ronald White, Wilhelm Mueller, Robert Fournier
  • Publication number: 20190113720
    Abstract: A photographing device is provided. The photographing device includes a first casing, a second casing, a first wide-angle lens, a second wide-angle lens, an axle and a controlling device. The first wide-angle lens is assembled on the first casing and the second wide-angle lens is assembled on the second casing. The axle is coupled to the first casing and the second casing to open or close the first casing and the second casing. The controlling device detects whether the first casing and the second casing are completely opened or closed to determine whether to enable a virtual reality (VR) function or a 360-degree panoramic function.
    Type: Application
    Filed: January 12, 2018
    Publication date: April 18, 2019
    Inventors: Kun-Da Lee, Cong-Wei Cai
  • Patent number: 10211161
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 19, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Feng Chiang, Cong-Wei Chen, I-Ting Chi, Shao-An Chen
  • Publication number: 20180246232
    Abstract: A gamma-ray analysis system is described for analyzing gamma-ray emitting radionuclides. The gamma-ray analysis system includes an analytical apparatus having a gamma-ray detector in operative communication with a modular and scalable shield assembly that encases a sample container having a sample to be tested. The detector communicates data to an electronic interface device that converts the data from an analog format to a digital format before a controller transmits the data to a central laboratory for further data processing, analysis and conclusion by qualified laboratory analysts. The controller runs an application software package on a graphic user interface that allows simple steps for conducting testing and data acquisition by the end user, while permitting real time data transmission between the field site and the central location. Functions were implemented for ensuring laboratory quality results while removing knowledge and experience requirements of an end user.
    Type: Application
    Filed: September 8, 2016
    Publication date: August 30, 2018
    Inventors: Cong Wei, Kelly M. Garnick, Thomas A. Scott, Elon M. Malkin, Jennifer T. Szymanski, Steve Laskos, James Cocks, Jeffrey Ralmondi, Richard Mowry, Hiram Gonzalez, Ronald White, Wilhelm Mueller, Robert Fournier
  • Publication number: 20180061767
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuan-Feng CHIANG, Cong-Wei CHEN, I-Ting CHI, Shao-An CHEN
  • Publication number: 20170374019
    Abstract: A method including receiving to-be-queried domain names; obtaining a query capacity of a preset query group; allocating the domain names to a matching query group according to the query capacity; and querying domain name information of the domain names through a query interface of the matching query group. In one aspect, by flexible domain name allocation, query resources are fully utilized, and the quantity of concurrent domain name queries is increased, thereby improving query efficiency and reducing a query time. In another aspect, queries are performed by using a particular query interface, and settings of the query interface are maintained, thereby avoiding that settings of the query interface need to be switched due to queries for different types of domain names, and improving query efficiency and reducing a query time.
    Type: Application
    Filed: June 27, 2017
    Publication date: December 28, 2017
    Inventor: Cong Wei
  • Publication number: 20160253768
    Abstract: The invention relates to a method for determining an integrated network loss rate in the UHV AC cross-regional electricity trading. The method includes fitting a curve relationship between integrated network loss rates and transmitting powers on the basis of theoretical calculations of the UHV AC transmission line loss, using a relational fitted curve between actual values of integrated network loss rates and transmitting powers calculated according to gateway power statistical data to perform geometrical average correction on the original curve, and making planned values of the integrated network loss rates to be closer to the actual values according to a method for determining UHV AC integrated network loss rates according to a correction curve function relation, which greatly increases fairness of the trading settlement. The method is simple and easy to implement with high accuracy, and applicable to planning and trading settlement of regular or real-time UHV AC electricity trading.
    Type: Application
    Filed: May 11, 2016
    Publication date: September 1, 2016
    Inventors: TING HU, Yinya Zhang, Dongjun Yang, Shunming Bai, Jingyou Xu, Daqiang Xiao, Cong Wei
  • Publication number: 20150034372
    Abstract: A circuit board for preventing pins of inserting components from being short-circuited during the welding process welding is provided. The circuit board includes an insulating base board comprising a base plate and at least one column of via set on the insulating base board. A plurality of copper foil rings are set on the base plate. An insulating dielectric layer is covered on the base plate and the plurality of copper foil rings. A plurality of solder mask openings are set on the insulating dielectric layer, each solder mask opening is shaped as a circular hole, and is concentric with one via. By covering the insulating dielectric layer on the copper foil rings, an adherence of copper foil and the insulating base board increases, thereby pins of the inserting components will not be easily disengaged from the copper foil in the insulating base board.
    Type: Application
    Filed: December 10, 2013
    Publication date: February 5, 2015
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: MENG-LONG FENG, XIAO-CONG WEI
  • Publication number: 20140368987
    Abstract: An exemplary integrated printed circuit board (PCB) includes a main PCB and a peripheral PCB. The main PCB includes a number of general purpose input/output (GPIO) ports and a number of first bonding pads, the bonding pads are located on edges of the main PCB and each GPIO port is electrically connected to one of the first bonding pads. The peripheral PCB includes a receiving space and a number of second bonding pads, the receiving space is used to receive the main PCB, the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space. When the first bonding pads of the main PCB are respectively welded with the second bonding pads, the main PCB and the peripheral PCB are connected to each other to form the integrated PCB. An electronic device incorporating an integrated PCB is also provided.
    Type: Application
    Filed: December 12, 2013
    Publication date: December 18, 2014
    Applicants: Hon Hai Precision Industry Co., Ltd., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
    Inventors: XIAO-CONG WEI, XIAO-ZHAN PENG