Patents by Inventor Cong Wei

Cong Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250078740
    Abstract: The present disclosure provides a driving circuitry, a driving method, a driving module, and a display device. The driving circuitry includes a driving signal generation circuitry, a gating circuitry, an output control circuitry and an output circuitry. The driving signal generation circuitry is configured to perform a shifting operation on an (N?1)th-level driving signal to obtain an Nth-level driving signal. The gating circuitry is configured to write a gating input signal into a first node under the control of a gating control signal. The output control circuitry is configured to perform an NAND operation on the Nth-level driving signal and a potential at a second end of the output control circuitry to obtain a first output signal. The output circuitry is configured to perform phase inversion on the first output signal to obtain and provide an output driving signal through an output driving end, where N is a positive integer.
    Type: Application
    Filed: May 23, 2023
    Publication date: March 6, 2025
    Inventors: Ziyang YU, Haijun QIU, Ming HU, Zhiliang JIANG, Tianyi CHENG, Jianpeng WU, Mengqi WANG, Qi WEI, Wenbo CHEN, Tiaomei ZHANG, Sifei AI, Cong LIU, Qian XU
  • Publication number: 20250075025
    Abstract: The present application relates to a polyurethane elastomer, modified silicone rubber, an acoustic lens, and an ultrasonic probe. The polyurethane elastomer includes a structural unit represented by formula I and a chain extender unit, wherein the structural unit is a polyurethane main chain structural unit: where R is selected from structural units represented by formula I-1 and/or formula I-2 and/or formula I-3 where R1, R2, and R3 are each independently selected from C2-C10 hydrocarbon chains; a number average molecular weight of the structural unit represented by each of the formula I-1, formula I-2, and formula I-3 is ranged from 400 to 5000; and a molar ratio of the chain extender unit to the structural unit represented by formula I is ranged from 0.3:1 to 0.8:1.
    Type: Application
    Filed: August 26, 2024
    Publication date: March 6, 2025
    Inventors: Haojie Wei, Kang Si, Cong Liu
  • Publication number: 20250070046
    Abstract: An integrated circuit includes a semiconductor substrate, an interconnection structure, a first dielectric layer, conductive pads, a second dielectric layer, conductive connectors, and an anti-stress layer. The interconnection structure is disposed on the semiconductor substrate. The first dielectric layer is disposed on the interconnection structure. The conductive pads are disposed on the first dielectric layer and are electrically connected to the interconnection structure. The second dielectric layer is disposed on the first dielectric layer to laterally surround the conductive pads. The conductive connectors are disposed on and electrically connected to the conductive pads. The anti-stress layer is disposed over the conductive pads and laterally surrounds some of the conductive connectors.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cong-Wei Yang, Yu Chen Lee, Chin-Hua Wang, Shin-Puu Jeng
  • Publication number: 20250062176
    Abstract: A device structure includes: an interposer including interposer dielectric material layers having formed therein interposer metal interconnect structures and die-side interposer bonding pads; at least one semiconductor die having formed therein in-die bonding pads that are bonded to a respective one of the die-side interposer bonding pads by metal-to-metal bonding; and a composite die frame laterally surrounding the at least one semiconductor die. The composite die frame includes a molding compound die frame portion including a molding compound material and frame edge reinforcement structures located at corners of the composite die frame and including a material having a lower coefficient of thermal expansion at 20 degrees Celsius than the molding compound material.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 20, 2025
    Inventors: Chin-Hua Wang, Tsung-Yen Lee, Cong-Wei Yang, Shin-Puu Jeng
  • Patent number: 12223912
    Abstract: A display substrate and a display apparatus are disclosed. The display substrate includes a base substrate including a display region and a peripheral region located on at least one side of the display region, and a first gate drive circuit, the first gate drive circuit includes a first clock signal line, a second clock signal line and N shift register units that are cascaded; each shift register unit of the N shift register units includes a first output circuit; the first output circuit includes the first output transistor, the orthographic projection of the second clock signal line on the base substrate is located between an orthographic projection of the first output transistor on the base substrate and the orthographic projection of the first clock signal line on the base substrate. The display substrate can reduce load of the first clock signal line and the second clock signal line.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: February 11, 2025
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Binyan Wang, Cong Liu, Tianyi Cheng, Feng Wei, Meng Li, Shiqian Dai, Kaipeng Sun, Lina Wang
  • Patent number: 12211433
    Abstract: A display substrate and a manufacturing method thereof, and a display device are provided. In the display substrate, each signal line includes a first conductive portion; for at least one signal line, the display substrate includes a multi-layer insulating pattern on a side of the first conductive portion away from the base substrate; a first insulating pattern in the multi-layer insulating pattern includes a hollow, and an orthographic projection of the hollow on the base substrate is at least partially in a region surrounded by an orthographic projection of the first conductive portion on the base substrate; and for at least one clock signal line included in the at least one signal line, a ratio between a size of the hollow in a first direction and a size of a shift register unit in the first direction ranges from ¾ to 1.
    Type: Grant
    Filed: February 29, 2024
    Date of Patent: January 28, 2025
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cong Liu, Binyan Wang, Tianyi Cheng, Feng Wei, Meng Li, Shiqian Dai, Kaipeng Sun
  • Publication number: 20250031570
    Abstract: The present application relates to the technical field of display, in particular to an organic electroluminescent material composition and an application thereof. The organic electroluminescent material composition of the present application comprise compound N and compound M, compound N and compound M cooperate with each other, resulting in an organic electroluminescent device comprising this material with better lifespan, lower driving voltage and higher efficiency at the same time.
    Type: Application
    Filed: February 26, 2024
    Publication date: January 23, 2025
    Applicant: NINGBO LUMILAN ADVANCED MATERIALS CO., LTD.
    Inventors: Ting-Wei WEI, Fengjiao LIU, Qinghua ZOU, Cong TANG, Xiaoxin RAN, Binyu XU, Xiaoyun XU, Renzhou WANG, Qixiang SONG, Huanda DING
  • Publication number: 20250031569
    Abstract: The present disclosure discloses an organic electroluminescent compound, a composition, a light emitting device and an application. The organic electroluminescent compound is a compound M having a structure shown in Formula (2), and Formula (2) is: in Formula (2), X1-X14 are selected from N or CR8, and R8 is selected from hydrogen or deuterium; L is selected from a connecting bond, substituted or unsubstituted C6-C30 arylenyl, and substituted or unsubstituted C3-C30 heteroarylenyl; Ar8-Ar9 are each independently selected from substituted or unsubstituted C6-C30 aryl and substituted or unsubstituted C3-C30 heteroaryl; and substituents are selected from one of or a combination of two of deuterium, halogen, cyano, C1-C6 alkyl, C3-C30 cycloalkyl, C6-C30 aryl and C3-C30 heteroaryl.
    Type: Application
    Filed: January 19, 2024
    Publication date: January 23, 2025
    Applicant: NINGBO LUMILAN ADVANCED MATERIALS CO., LTD.
    Inventors: Ting-Wei WEI, Fengjiao LIU, Qinghua ZOU, Cong TANG, Xiaoxin RAN, Binyu XU, Xiaoyun XU, Renzhou WANG, Qixiang SONG, Huanda DING, Zhi-Kuan CHEN
  • Publication number: 20240388074
    Abstract: A wall mountable backplate for securing an electro vehicle service equipment, EVSE, to a wall is provided. The wall mountable backplate includes a housing having one or more openings for guiding one or more cables into the housing. The housing is configured for receiving an electrical connector having a plurality of electrical contacts for connecting a plurality of corresponding electrical contacts of the EVSE. The housing has one or more positioning elements for mating with corresponding positioning elements of the EVSE. Further, the housing has one or more mounting elements for either mounting a front cover for providing an enclosed environmentally protected interior volume or mounting the EVSE to the housing.
    Type: Application
    Filed: May 14, 2024
    Publication date: November 21, 2024
    Inventors: Vincent-Cong WEI, Sven-Yushan Qi, Pan Chen
  • Publication number: 20240362902
    Abstract: Vision Transformers (ViT) have shown their competitive advantages performance-wise compared to convolutional neural networks (CNNs) though they often come with high computational costs. Methods, systems and techniques herein learn instance-dependent attention patterns, utilizing a lightweight connectivity predictor module to estimate a connectivity score of each pair of tokens. Intuitively, two tokens have high connectivity scores if the features are considered relevant either spatially or semantically. As each token only attends to a small number of other tokens, the binarized connectivity masks are often very sparse by nature providing an opportunity to accelerate the network via sparse computations. Equipped with the learned unstructured attention pattern, sparse attention ViT produces a superior Pareto-optimal trade-off between FLOPs and top-1 accuracy on ImageNet compared to token sparsity (48%˜69% FLOPs reduction of MHSA; accuracy drop within 0.4%).
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Applicant: ModiFace Inc.
    Inventors: Cong WEI, Brendan DUKE, Ruowei JIANG
  • Publication number: 20240249958
    Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
  • Publication number: 20240198839
    Abstract: A computer-implemented method for method for electric vehicle charging access control includes a charging station for electric vehicles that detects presence of an electric vehicle available for establishing a wireless data connection, establishes a wireless data connection with the electric vehicle, receives, via the wireless data connection, identification data identifying the electric vehicle, and authorizes the charging of the electric vehicle in response to determining that the electric vehicle is registered as eligible for using the charging station based on the identification data.
    Type: Application
    Filed: December 19, 2023
    Publication date: June 20, 2024
    Applicant: ABB E-mobility B.V.
    Inventors: Vincent-Cong Wei, Pan Chen, Sven Qi
  • Publication number: 20240140222
    Abstract: The present disclosure relates to a socket with a fixing device and a charging cabinet for electric vehicles with the socket. The fixing device includes a connection mechanism, which is provided on one side of a mainbody of the socket and is adapted to releasably connect the socket to a mounting object to which the socket is to be mounted by means of a first fixing member, and a pivot mechanism, which is provided between the other side of the mainbody opposite to the connection mechanism and the mounting object, so that the socket is pivotable relative to the mounting object when released from the mounting object. Through the fixing device for the electric vehicle charging gun socket, the charging gun socket can be easily and quickly fixed on a mounting object, such as a charging cabinet, since the number of required fixing parts is reduced.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Pan CHEN, Vincent-Cong WEI, Sven QI, Xiao Fei XIE
  • Patent number: 11934235
    Abstract: A server includes a chassis and a storage module. The storage module is disposed in the chassis. The storage module includes a base, a first electrical connector, a storage device, a connecting member and a first fixing member. A first side of the base has a first fixing portion. The first electrical connector is disposed at a second side of the base, wherein the second side is opposite to the first side. The storage device has a second electrical connector. The connecting member is connected to the storage device. The first fixing member is disposed on the connecting member. The second electrical connector is connected to the first electrical connector and the first fixing member is fixed to the first fixing portion, so as to fix the storage device on the base.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: March 19, 2024
    Assignee: Wiwynn Corporation
    Inventors: Shih-Hung Chen, Cong-Wei Yang
  • Publication number: 20240069610
    Abstract: A server includes a chassis and a storage module. The storage module is disposed in the chassis. The storage module includes a base, a first electrical connector, a storage device, a connecting member and a first fixing member. A first side of the base has a first fixing portion. The first electrical connector is disposed at a second side of the base, wherein the second side is opposite to the first side. The storage device has a second electrical connector. The connecting member is connected to the storage device. The first fixing member is disposed on the connecting member. The second electrical connector is connected to the first electrical connector and the first fixing member is fixed to the first fixing portion, so as to fix the storage device on the base.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 29, 2024
    Applicant: Wiwynn Corporation
    Inventors: Shih-Hung Chen, Cong-Wei Yang
  • Publication number: 20240034179
    Abstract: A system and method for an electric vehicle fueling system (EVFS) includes an AC grid input receiving AC power from an electric grid; a main control chip controlling the EVFS to perform a charge session of an electric vehicle; a power module supplying the main control chip with power; a power loss detection module providing a power loss signal when the AC power is unavailable; wherein the power module comprises a super capacitor storing an auxiliary supply power that is supplied to the main control chip; wherein, when the main control chip receives the power loss signal, the main control chip saves session information of the charging session; and wherein the session information comprises information needed to continue or complete the charging session.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 1, 2024
    Applicant: ABB E-mobility B.V.
    Inventors: Pan Chen, Vincent-Cong Wei, Sven Qi
  • Patent number: 10580096
    Abstract: The invention relates to a method for determining an integrated network loss rate in the UHV AC cross-regional electricity trading. The method includes fitting a curve relationship between integrated network loss rates and transmitting powers on the basis of theoretical calculations of the UHV AC transmission line loss, using a relational fitted curve between actual values of integrated network loss rates and transmitting powers calculated according to gateway power statistical data to perform geometrical average correction on the original curve, and making planned values of the integrated network loss rates to be closer to the actual values according to a method for determining UHV AC integrated network loss rates according to a correction curve function relation, which greatly increases fairness of the trading settlement. The method is simple and easy to implement with high accuracy, and applicable to planning and trading settlement of regular or real-time UHV AC electricity trading.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: March 3, 2020
    Assignees: STATE GRID CORPORATION OF CHINA ECONOMIC & TECHNOLOGY RESEARCH, INSTITUTE OF HUBEI ELECTRIC POWER COMPANY
    Inventors: Ting Hu, Yinya Zhang, Dongjun Yang, Shunming Bai, Jingyou Xu, Daqiang Xiao, Cong Wei
  • Patent number: 10379234
    Abstract: A gamma-ray analysis system is described for analyzing gamma-ray emitting radionuclides. The gamma-ray analysis system includes an analytical apparatus having a gamma-ray detector in operative communication with a modular and scalable shield assembly that encases a sample container having a sample to be tested. The detector communicates data to an electronic interface device that converts the data from an analog format to a digital format before a controller transmits the data to a central laboratory for further data processing, analysis and conclusion by qualified laboratory analysts. The controller runs an application software package on a graphic user interface that allows simple steps for conducting testing and data acquisition by the end user, while permitting real time data transmission between the field site and the central location. Functions were implemented for ensuring laboratory quality results while removing knowledge and experience requirements of an end user.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 13, 2019
    Assignees: THE UNITED STATES OF AMERICA, as represented by the Secretary, Department of Health and Human Services, Mirion Technologies, Inc., Mirion Technologies (Canberra UK) Limited
    Inventors: Cong Wei, Kelly M. Garnick, Thomas A. Scott, Elon M. Malkin, Jennifer T. Szymanski, Steve Laskos, James Cocks, Jeffrey Raimondi, Richard Mowry, Hiram Gonzalez, Ronald White, Wilhelm Mueller, Robert Fournier
  • Publication number: 20190113720
    Abstract: A photographing device is provided. The photographing device includes a first casing, a second casing, a first wide-angle lens, a second wide-angle lens, an axle and a controlling device. The first wide-angle lens is assembled on the first casing and the second wide-angle lens is assembled on the second casing. The axle is coupled to the first casing and the second casing to open or close the first casing and the second casing. The controlling device detects whether the first casing and the second casing are completely opened or closed to determine whether to enable a virtual reality (VR) function or a 360-degree panoramic function.
    Type: Application
    Filed: January 12, 2018
    Publication date: April 18, 2019
    Inventors: Kun-Da Lee, Cong-Wei Cai
  • Patent number: 10211161
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 19, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Feng Chiang, Cong-Wei Chen, I-Ting Chi, Shao-An Chen