Patents by Inventor Cong Wei

Cong Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190289523
    Abstract: A system that determines a cell density and cell type in an area corresponding to a location of a user equipment; determines a mobility state of the user equipment based on the determined cell density and the determined cell type; and controls cell reselection for the user equipment based on the determined mobility state of the user equipment.
    Type: Application
    Filed: April 30, 2019
    Publication date: September 19, 2019
    Applicant: Sony Corporation
    Inventors: Xiaodong XU, Cuibo YU, Yateng HONG, Ya LIU, Cong ZHENG, Liyao WEI, Xiaojia SONG, Zhongbin QIN
  • Patent number: 10379234
    Abstract: A gamma-ray analysis system is described for analyzing gamma-ray emitting radionuclides. The gamma-ray analysis system includes an analytical apparatus having a gamma-ray detector in operative communication with a modular and scalable shield assembly that encases a sample container having a sample to be tested. The detector communicates data to an electronic interface device that converts the data from an analog format to a digital format before a controller transmits the data to a central laboratory for further data processing, analysis and conclusion by qualified laboratory analysts. The controller runs an application software package on a graphic user interface that allows simple steps for conducting testing and data acquisition by the end user, while permitting real time data transmission between the field site and the central location. Functions were implemented for ensuring laboratory quality results while removing knowledge and experience requirements of an end user.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 13, 2019
    Assignees: THE UNITED STATES OF AMERICA, as represented by the Secretary, Department of Health and Human Services, Mirion Technologies, Inc., Mirion Technologies (Canberra UK) Limited
    Inventors: Cong Wei, Kelly M. Garnick, Thomas A. Scott, Elon M. Malkin, Jennifer T. Szymanski, Steve Laskos, James Cocks, Jeffrey Raimondi, Richard Mowry, Hiram Gonzalez, Ronald White, Wilhelm Mueller, Robert Fournier
  • Publication number: 20190235902
    Abstract: An illustrative embodiment disclosed herein is a method by a data analytics chip, including finding a contention within a first predetermined amount of time, sorting user virtual machines based on consumption of each of the user virtual machines, and identifying a first subset of the user virtual machines. The first subset of the plurality of user virtual machines satisfies consumption criteria.
    Type: Application
    Filed: January 31, 2018
    Publication date: August 1, 2019
    Inventors: Ribao Wei, Abhinay Nagpal, Himanshu Shukla, Weiheng Chen, Cong Liu
  • Patent number: 10321378
    Abstract: A system that determines a cell density and cell type in an area corresponding to a location of a user equipment; determines a mobility state of the user equipment based on the determined cell density and the determined cell type; and controls cell reselection for the user equipment based on the determined mobility state of the user equipment.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: June 11, 2019
    Assignee: SONY CORPORATION
    Inventors: Xiaodong Xu, Cuibo Yu, Yateng Hong, Ya Liu, Cong Zheng, Liyao Wei, Xiaojia Song, Zhongbin Qin
  • Publication number: 20190113720
    Abstract: A photographing device is provided. The photographing device includes a first casing, a second casing, a first wide-angle lens, a second wide-angle lens, an axle and a controlling device. The first wide-angle lens is assembled on the first casing and the second wide-angle lens is assembled on the second casing. The axle is coupled to the first casing and the second casing to open or close the first casing and the second casing. The controlling device detects whether the first casing and the second casing are completely opened or closed to determine whether to enable a virtual reality (VR) function or a 360-degree panoramic function.
    Type: Application
    Filed: January 12, 2018
    Publication date: April 18, 2019
    Inventors: Kun-Da Lee, Cong-Wei Cai
  • Patent number: 10211161
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 19, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Feng Chiang, Cong-Wei Chen, I-Ting Chi, Shao-An Chen
  • Publication number: 20180246232
    Abstract: A gamma-ray analysis system is described for analyzing gamma-ray emitting radionuclides. The gamma-ray analysis system includes an analytical apparatus having a gamma-ray detector in operative communication with a modular and scalable shield assembly that encases a sample container having a sample to be tested. The detector communicates data to an electronic interface device that converts the data from an analog format to a digital format before a controller transmits the data to a central laboratory for further data processing, analysis and conclusion by qualified laboratory analysts. The controller runs an application software package on a graphic user interface that allows simple steps for conducting testing and data acquisition by the end user, while permitting real time data transmission between the field site and the central location. Functions were implemented for ensuring laboratory quality results while removing knowledge and experience requirements of an end user.
    Type: Application
    Filed: September 8, 2016
    Publication date: August 30, 2018
    Inventors: Cong Wei, Kelly M. Garnick, Thomas A. Scott, Elon M. Malkin, Jennifer T. Szymanski, Steve Laskos, James Cocks, Jeffrey Ralmondi, Richard Mowry, Hiram Gonzalez, Ronald White, Wilhelm Mueller, Robert Fournier
  • Publication number: 20180061767
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuan-Feng CHIANG, Cong-Wei CHEN, I-Ting CHI, Shao-An CHEN
  • Publication number: 20170374019
    Abstract: A method including receiving to-be-queried domain names; obtaining a query capacity of a preset query group; allocating the domain names to a matching query group according to the query capacity; and querying domain name information of the domain names through a query interface of the matching query group. In one aspect, by flexible domain name allocation, query resources are fully utilized, and the quantity of concurrent domain name queries is increased, thereby improving query efficiency and reducing a query time. In another aspect, queries are performed by using a particular query interface, and settings of the query interface are maintained, thereby avoiding that settings of the query interface need to be switched due to queries for different types of domain names, and improving query efficiency and reducing a query time.
    Type: Application
    Filed: June 27, 2017
    Publication date: December 28, 2017
    Inventor: Cong Wei
  • Publication number: 20160253768
    Abstract: The invention relates to a method for determining an integrated network loss rate in the UHV AC cross-regional electricity trading. The method includes fitting a curve relationship between integrated network loss rates and transmitting powers on the basis of theoretical calculations of the UHV AC transmission line loss, using a relational fitted curve between actual values of integrated network loss rates and transmitting powers calculated according to gateway power statistical data to perform geometrical average correction on the original curve, and making planned values of the integrated network loss rates to be closer to the actual values according to a method for determining UHV AC integrated network loss rates according to a correction curve function relation, which greatly increases fairness of the trading settlement. The method is simple and easy to implement with high accuracy, and applicable to planning and trading settlement of regular or real-time UHV AC electricity trading.
    Type: Application
    Filed: May 11, 2016
    Publication date: September 1, 2016
    Inventors: TING HU, Yinya Zhang, Dongjun Yang, Shunming Bai, Jingyou Xu, Daqiang Xiao, Cong Wei
  • Publication number: 20150034372
    Abstract: A circuit board for preventing pins of inserting components from being short-circuited during the welding process welding is provided. The circuit board includes an insulating base board comprising a base plate and at least one column of via set on the insulating base board. A plurality of copper foil rings are set on the base plate. An insulating dielectric layer is covered on the base plate and the plurality of copper foil rings. A plurality of solder mask openings are set on the insulating dielectric layer, each solder mask opening is shaped as a circular hole, and is concentric with one via. By covering the insulating dielectric layer on the copper foil rings, an adherence of copper foil and the insulating base board increases, thereby pins of the inserting components will not be easily disengaged from the copper foil in the insulating base board.
    Type: Application
    Filed: December 10, 2013
    Publication date: February 5, 2015
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: MENG-LONG FENG, XIAO-CONG WEI
  • Publication number: 20140368987
    Abstract: An exemplary integrated printed circuit board (PCB) includes a main PCB and a peripheral PCB. The main PCB includes a number of general purpose input/output (GPIO) ports and a number of first bonding pads, the bonding pads are located on edges of the main PCB and each GPIO port is electrically connected to one of the first bonding pads. The peripheral PCB includes a receiving space and a number of second bonding pads, the receiving space is used to receive the main PCB, the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space. When the first bonding pads of the main PCB are respectively welded with the second bonding pads, the main PCB and the peripheral PCB are connected to each other to form the integrated PCB. An electronic device incorporating an integrated PCB is also provided.
    Type: Application
    Filed: December 12, 2013
    Publication date: December 18, 2014
    Applicants: Hon Hai Precision Industry Co., Ltd., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
    Inventors: XIAO-CONG WEI, XIAO-ZHAN PENG
  • Publication number: 20130320606
    Abstract: A wave soldering carrier includes a base plate and a fixing member positioned on the base plate. The base plate defines a receiving recess and a number of through holes communicating with the receiving recess. The receiving recess receives a circuit board. The through holes are arranged and shaped corresponding to a number of electronic components on the circuit board. The fixing member includes a shaft including a fixing shaft fixed to the base plate and a restricting shaft extending from an end of the fixing shaft. A diameter of the restricting shaft is greater than that of the fixing shaft, thereby forming a step. The fixing member further includes a rotatable member rotatably connected to the fixing shaft and sandwiched between the shoulder and the base plate. The rotation member is rotatable to a preset position, where a distal end of the rotatable member firmly contacts the circuit board.
    Type: Application
    Filed: April 29, 2013
    Publication date: December 5, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: TAO ZHAO, XIAO-CONG WEI, WEI-HSIEN TSENG
  • Patent number: 6899784
    Abstract: An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 31, 2005
    Assignees: International Business Machines Corporation, EcoPhysics AG
    Inventors: Leping Li, Steven G. Barbee, Scott R. Cline, James A. Gilhooly, Walter Imfeld, Werner Moser, Adrian Siegrist, Heinz Stunzi, Xinhui Wang, Cong Wei
  • Patent number: 6878629
    Abstract: An apparatus for measuring ammonia gas concentration in an ongoing mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: April 12, 2005
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven G. Barbee, Scott R. Cline, James A. Gilhooly, Xinhui Wang, Cong Wei
  • Publication number: 20030206114
    Abstract: An instrumentation device for controlling one or more instruments, wherein the instrumentation device having an interface which accepts at least three sets of inputs and transmits at least three sets of outputs, the interface capable of transmitting signals of different voltage between the individual inputs and individual outputs of the interface and wherein the interface is capable of accepting, translating and transmitting as one of the at least three sets of outputs, input from more than one set of the at least sets of three inputs.
    Type: Application
    Filed: August 30, 2001
    Publication date: November 6, 2003
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, Cong Wei, Werner Moser, Matthias Kutter, Joseph Knee, Walter Imfeld, Bruno Greuter, Heinz Stuenzi
  • Patent number: 6506341
    Abstract: An apparatus is described for detecting the presence of a gaseous chemical produced during a chemical-mechanical polishing operation. The apparatus includes a catalytic converter, a reaction chamber and a light sensor. The catalytic converter, heated to about 800° C. converts the chemical to a different chemical product. The reaction chamber produces an excited species; the pressure in the reaction chamber is maintained sufficiently low to substantially avoid collisional deactivation of the excited species, so as to permit real-time detection of the chemical. A light signal from the excited species is input to the light sensor. An output from the light sensor corresponds to the real-time detection of the chemical, thereby permitting real-time control of the chemical-mechanical polishing operation.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: January 14, 2003
    Assignees: International Business Machines Corporation, ECO Physics AG
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei, Werner Moser, Matthias Kutter, Joseph Knee, Walter Imfeld, Bruno Greuter, Heinz Stuenzi
  • Patent number: 6440263
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: August 27, 2002
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, William Joseph Surovic, Cong Wei
  • Patent number: 6419785
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example, ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. The reaction product is extracted as a gas from the slurry and monitored using a threshold photoionization mass spectrometer.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: July 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei, Chienfan Yu
  • Patent number: 6291351
    Abstract: A method is described for fabricating a cloisonné structure, in which a top surface of a metal oxide layer is made coplanar with a top surface of a metallic structure formed on a substrate. A nitride layer is deposited on at least the top surface of the metallic structure, and the metal oxide layer is deposited over the metallic structure and the nitride layer. The metal oxide layer is then polished by a chemical-mechanical polishing (CMP) process using a slurry, to expose the nitride layer on the top surface of the metallic structure. Polishing of the nitride layer causes ammonia to be generated in the slurry. The ammonia is extracted as a gas from the slurry, and a signal is generated in accordance with the ammonia concentration. The CMP process is terminated in accordance with a change in the signal. In a preferred embodiment, the metal oxide is aluminum oxide, the nitride is aluminum nitride, and the nitride layer is deposited as a conformal layer on the substrate and the metallic structure.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: September 18, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Eric James Lee, Francisco A. Martin, Cong Wei