Patents by Inventor Congge Lu

Congge Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure and packaging method of digital circuit
    Patent number: 11791232
    Abstract: A packaging structure includes: a substrate provided with a through-cavity penetrating up and down, and a metal heat sink on a front surface of the substrate; a bonding chip mounting area and a first passive element mounting area on the front surface, and a flip chip mounting area, a second passive element mounting area and a pin lead mounting area are provided on a back surface of the substrate; a first sealing ring located at the periphery of the bonding chip mounting area and the first passive element mounting area; a first cover plate packaged on the first sealing ring; a second sealing ring located at the periphery of the flip chip mounting area and the second passive element mounting area with the pin lead mounting area being located at the periphery of the second sealing ring; and a second cover plate packaged on the second sealing ring.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: October 17, 2023
    Assignee: The 13th Research Institute of China Electronics Technology Group Corporation
    Inventors: Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang Duan, Dapeng Bi, Congge Lu
  • PACKAGING STRUCTURE AND PACKAGING METHOD OF DIGITAL CIRCUIT
    Publication number: 20210202346
    Abstract: A packaging structure includes: a substrate provided with a through-cavity penetrating up and down, and a metal heat sink on a front surface of the substrate; a bonding chip mounting area and a first passive element mounting area on the front surface, and a flip chip mounting area, a second passive element mounting area and a pin lead mounting area are provided on a back surface of the substrate; a first sealing ring located at the periphery of the bonding chip mounting area and the first passive element mounting area; a first cover plate packaged on the first sealing ring; a second sealing ring located at the periphery of the flip chip mounting area and the second passive element mounting area with the pin lead mounting area being located at the periphery of the second sealing ring; and a second cover plate packaged on the second sealing ring.
    Type: Application
    Filed: March 1, 2021
    Publication date: July 1, 2021
    Inventors: Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang Duan, Dapeng Bi, Congge Lu