Patents by Inventor Connie Gettinger

Connie Gettinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050068757
    Abstract: According to one aspect of the present invention, an electronic assembly and a method of forming an electronic assembly are provided. A semiconductor package includes a package substrate with a microelectronic die mounted to a first side and contact formations attached to a second side thereof. A stress compensation layer is formed on the first surface between the contact formations. The semiconductor package is then attached to a circuit board leaving an air space between the stress compensation layer and the circuit board. The stress compensation layer reduces stress on the contact formations and increases solder joint reliability.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventors: Saikumar Jayaraman, Terry Sterrett, Connie Gettinger, Vijay Wakharkar, Agnes Padovani