Abstract: A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.

Abstract: The invention relates to a method of making a local structure from an organic mandrel on a substrate at the submicrometer level. The mandrel is formed from an organic layer deposited on the substrate. The mandrel is then removed by exposure to an oxygen plasma environment, thus leaving a cavity. A local structure material is deposited into the cavity and polished to form the local structure. In the preferred method of the invention, an electrically conducting, local interconnect is formed from a polyimide mandrel on a wafer used to make integrated circuits.