Patents by Inventor Connie S. McCausland

Connie S. McCausland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microcircuit via interconnect
    Patent number: 5717247
    Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: February 10, 1998
    Assignee: Grumman Aerospace Corporation
    Inventors: Wei H. Koh, Connie S. McCausland
  • Method of forming a microcircuit via interconnect
    Patent number: 5599744
    Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.
    Type: Grant
    Filed: February 6, 1995
    Date of Patent: February 4, 1997
    Assignee: Grumman Aerospace Corporation
    Inventors: Wei H. Koh, Connie S. McCausland