Patents by Inventor Connie Wang

Connie Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220281662
    Abstract: This disclosure provides a package for seasoning pods, including: a front cover including a first external sheet and a first inner sheet; a back cover including a second external sheet and a second inner sheet; a connecting portion attaching the front cover to the back cover; and one or more pod compartments within the package. Each pod compartment is configured to receive a seasoning pod.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 8, 2022
    Inventors: Lisa Carson, Connie Wang
  • Patent number: 11407572
    Abstract: This disclosure provides a package for a product, including a capsule body configured to accommodate a predetermined amount of the product; a handle connected to one side of the capsule body; and a lid, wherein the capsule body is sealed with the lid. The capsule body, the handle, and the lid are made of an oxygen-proof, lightproof, moisture-proof, and sustainable material, e.g., aluminum. A modified atmosphere packaging technique is used during the packaging process to extend shelf life.
    Type: Grant
    Filed: August 2, 2020
    Date of Patent: August 9, 2022
    Assignee: OCCO CO.
    Inventors: Lisa Lorraine Carson, Connie Wang
  • Patent number: 11039674
    Abstract: A breakage resistant light bulb headband having increased flexibility includes a single piece injection-molded main body with integral bulb holding structures, a clip-on battery case, and wiring that connects light sources and a power source in the battery case by extending along an outside surface of the headband so as to eliminate the need for an internal passage, and a relatively thick multiple piece construction.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: June 22, 2021
    Inventor: Connie Wang
  • Publication number: 20210101731
    Abstract: This disclosure provides a package for a product, including a capsule body configured to accommodate a predetermined amount of the product; a handle connected to one side of the capsule body; and a lid, wherein the capsule body is sealed with the lid. The capsule body, the handle, and the lid are made of an oxygen-proof, lightproof, moisture-proof, and sustainable material, e.g., aluminum. A modified atmosphere packaging technique is used during the packaging process to extend shelf life.
    Type: Application
    Filed: August 2, 2020
    Publication date: April 8, 2021
    Inventors: Lisa Lorraine Carson, Connie Wang
  • Publication number: 20200170370
    Abstract: A breakage resistant light bulb headband having increased flexibility includes a single piece injection-molded main body with integral bulb holding structures, a clip-on battery case, and wiring that connects light sources and a power source in the battery case by extending along an outside surface of the headband so as to eliminate the need for an internal passage, and a relatively thick multiple piece construction.
    Type: Application
    Filed: January 22, 2020
    Publication date: June 4, 2020
    Inventor: Connie Wang
  • Patent number: 10561217
    Abstract: A breakage resistant light bulb headband having increased flexibility includes a single piece injection-molded main body with integral bulb holding structures, a clip-on battery case, and wiring that connects light sources and a power source in the battery case by extending along an outside surface of the headband so as to eliminate the need for an internal passage, and a relatively thick multiple piece construction.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: February 18, 2020
    Inventor: Connie Wang
  • Patent number: 9299643
    Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 29, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu
  • Patent number: 9240418
    Abstract: Methods and structures for reducing resistance in wordlines of an integrated circuit memory device are disclosed. In one embodiment, the method includes forming multiple columns of polycrystalline silicon for respective number of wordlines, forming core transistor junctions and periphery transistor junctions associated with the wordlines, performing a salicidation process for the periphery transistor junction and performing a salicidation process for the columns of polycrystalline silicon to from the wordlines with low resistance.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: January 19, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventors: Shenqing Fang, Jihwan Choi, Connie Wang, Eunha Kim
  • Patent number: 8919981
    Abstract: This invention provides a cup with twinkling light effects, primarily comprising an inner cup, an outer cup, and a light unit, with the lower half of the inner cup having a number of arched convex strips, and the base of which has diamond-facet of concave and convex cones. As a result, when the light unit at the base of the outer cup is activated, the effects of the arched convex strips and diamond facets cause the cup to produce numerous refractions of the light source, creating twinkling rays of light with dazzling variation.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: December 30, 2014
    Inventors: Connie Wang, Wei Hung Yu
  • Publication number: 20140268681
    Abstract: An exercise wristband that can extend illumination time, comprised of a translucent, flexible wristband and lighting unit, wherein the surface of the wristband has a 3D embossed and colored concave and convex design or text, and the underside has an insertion slot and cover. A lighting unit fits inside the insertion slot in the wristband and includes a light component, Integrated Circuit board (IC board), and a highly sensitive vibration switch.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Inventors: Connie WANG, Wei Hung YU
  • Publication number: 20140240962
    Abstract: This invention provides a cup with twinkling light effects, primarily comprising an inner cup, an outer cup, and a light unit, with the lower half of the inner cup having a number of arched convex strips, and the base of which has diamond-facet of concave and convex cones. As a result, when the light unit at the base of the outer cup is activated, the effects of the arched convex strips and diamond facets cause the cup to produce numerous refractions of the light source, creating twinkling rays of light with dazzling variation.
    Type: Application
    Filed: February 25, 2013
    Publication date: August 28, 2014
    Inventors: Connie WANG, Wei Hung YU
  • Publication number: 20140151887
    Abstract: An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines and staggered bit line contacts extend through the first inter-level dielectric layer. Each of a plurality of source line vias and a plurality of staggered bit line vias extend through the second inter-level dielectric layer to each respective one of the plurality of source lines and the plurality of staggered bit line contacts. The source lines and staggered bit line contacts that extend through the first inter-level dielectric layer are formed together by a first set of fabrication processes. The source line vias and staggered bit line contacts that extend through the second inter-level dielectric layer are also formed together by a second set of fabrication processes.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 5, 2014
    Applicant: Spansion LLC
    Inventors: Shenqing Fang, Connie WANG, Wen Yu, Fei Wang
  • Publication number: 20140145337
    Abstract: An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines extend through the first inter-level dielectric layer. Each of a plurality of source line vias extend through the second inter-level dielectric layer to each respective one of the plurality of source lines. Each of the plurality of staggered bit line contacts extend through the first and second inter-level dielectric layes to respective bit lines.
    Type: Application
    Filed: December 10, 2013
    Publication date: May 29, 2014
    Applicant: Spansion LLC
    Inventors: Shenqing Fang, Connie WANG, Wen Yu, Fei Wang
  • Patent number: 8669597
    Abstract: An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines and staggered bit line contacts extend through the first inter-level dielectric layer. Each of a plurality of source line vias and a plurality of staggered bit line vias extend through the second inter-level dielectric layer to each respective one of the plurality of source lines and the plurality of staggered bit line contacts. The source lines and staggered bit line contacts that extend through the first inter-level dielectric layer are formed together by a first set of fabrication processes. The source line vias and staggered bit line contacts that extend through the second inter-level dielectric layer are also formed together by a second set of fabrication processes.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: March 11, 2014
    Assignee: Spansion LLC
    Inventors: Shenqing Fang, Connie Wang, Wen Yu, Fei Wang
  • Patent number: D698954
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: February 4, 2014
    Inventors: Connie Wang, Wei Hung Yu
  • Patent number: D698955
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 4, 2014
    Inventors: Connie Wang, Wei Hung Yu
  • Patent number: D709402
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: July 22, 2014
    Inventor: Connie Wang
  • Patent number: D736035
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: August 11, 2015
    Inventor: Connie Wang
  • Patent number: D767747
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 27, 2016
    Inventor: Connie Wang
  • Patent number: D984284
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: April 25, 2023
    Assignee: OCCO CO.
    Inventors: Lisa Carson, Connie Wang