Abstract: A laser diode apparatus includes a laser diode array having an emission surface and a mounting surface. A heatsink is in thermal communication with the laser diode array at the mounting surface. The heatsink extends perpendicularly away from at least one edge of the emission surface. Positive and negative electrical terminal blocks are in mechanical communication with the heatsink opposite the laser diode array. Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals. The electrical foils extend perpendicularly away from the emission surface. The positive and negative electrical terminal blocks are electrically isolated from the heatsink. A cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, and electrical foils is not larger than 120% of a cross-sectional footprint of the laser diode array.