Patents by Inventor Connor R. Duke
Connor R. Duke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210083315Abstract: The disclosed technology relates to a battery utilizing an indicator to orient an unopposed portion of a cathode or anode with respect to a battery can, and a tag to generate an electromagnetic field to mitigate or eliminate an electromagnetic field generated by the unopposed portion of the cathode or anode. The battery includes a wound set of layers including a cathode, an anode, and a separator; a can housing the wound set of layers; a lid disposed atop of the can to enclose the wound set of layers within the can; and a tag coupled to the lid. An unopposed portion of the cathode or anode generates a first electromagnetic field. The tag generates a second electromagnetic field to oppose the first electromagnetic field.Type: ApplicationFiled: September 11, 2020Publication date: March 18, 2021Inventors: Katherine I. PREGLER, Kyle Tse, Samantha K. Young, Jason W. Brinsfield, Mei Zhang, Charles Greenlee, Kevin R. Richardson, Susheel Teja Gogineni, Ethan L. Huwe, Connor R. Duke, Michael B. Nussbaum, Shawn G. Fink, Kirill Kalinichev
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Patent number: 10431382Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.Type: GrantFiled: August 31, 2015Date of Patent: October 1, 2019Assignee: Apple Inc.Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke
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Patent number: 9913400Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: May 26, 2015Date of Patent: March 6, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 9805867Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.Type: GrantFiled: August 1, 2013Date of Patent: October 31, 2017Assignee: Apple Inc.Inventors: Shawn X. Arnold, Jeffrey M. Thoma, Connor R. Duke, Yanchu Xu, Nelson J. Kottke
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Patent number: 9596756Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.Type: GrantFiled: September 6, 2013Date of Patent: March 14, 2017Assignee: Apple Inc.Inventors: Amanda R. Rainer, Connor R. Duke, James W. Bilanski, Jeffrey M. Thoma, Michael Eng, Mingzhe Li, Sung Woo Yoo, Miguel Alejandro Lara-Pena, Weng Choy Foo, Kieran Poulain
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Publication number: 20170064811Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.Type: ApplicationFiled: August 31, 2015Publication date: March 2, 2017Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke
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Patent number: 9558875Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.Type: GrantFiled: October 3, 2016Date of Patent: January 31, 2017Assignee: Apple Inc.Inventors: Michael Eng, Kieran Poulain, Curtis C. Mead, Connor R. Duke
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Publication number: 20170025210Abstract: An electronic device may has e a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.Type: ApplicationFiled: October 3, 2016Publication date: January 26, 2017Inventors: Michael Eng, Kieran Poulain, Curtis C. Mead, Connor R. Duke
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Patent number: 9520645Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.Type: GrantFiled: April 25, 2014Date of Patent: December 13, 2016Assignee: Apple Inc.Inventors: Derek J. Walters, Michael Eng, Brian S. Tryon, Connor R. Duke, Kieran Poulain, Nicholas J. Kunst, Shaohai Chen, Shaoqing Xiang, Sung Woo Yoo, Chun Cheng Teo, Paul Nangeroni, Eric Steven Jol
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Publication number: 20160351330Abstract: A multi-layer capacitor such as a multi-layer-ceramic-capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a lower dielectric constant than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include the upper dielectric and electrode layers in a top portion of the MLCC; and the lower dielectric and electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. As an example, the dielectric constant value of the lower dielectric layers may be between 1.5 and 3.5 times less than that of the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing. Other embodiments are also described and claimed.Type: ApplicationFiled: May 26, 2015Publication date: December 1, 2016Inventors: Zhong-Qing Gong, Kevin R. Richardson, Connor R. Duke, Yanchu Xu, Benjamin A. Bard
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Patent number: 9460838Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.Type: GrantFiled: August 20, 2015Date of Patent: October 4, 2016Assignee: Apple Inc.Inventors: Michael Eng, Kieran Poulain, Curtis C. Mead, Connor R. Duke
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Patent number: 9330849Abstract: A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.Type: GrantFiled: May 22, 2014Date of Patent: May 3, 2016Assignee: Apple Inc.Inventors: Zhong-Qing Gong, Kevin R. Richardson, Yanchu Xu, Connor R. Duke, Benjamin A. Bard
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Patent number: 9285846Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: June 5, 2014Date of Patent: March 15, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Publication number: 20160064130Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.Type: ApplicationFiled: August 20, 2015Publication date: March 3, 2016Inventors: Michael Eng, Kieran Poulain, Curtis C. Mead, Connor R. Duke
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Publication number: 20150253822Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: ApplicationFiled: May 26, 2015Publication date: September 10, 2015Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Publication number: 20150243440Abstract: A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.Type: ApplicationFiled: May 22, 2014Publication date: August 27, 2015Applicant: Apple Inc.Inventors: Zhong-Qing Gong, Kevin R. Richardson, Yanchu Xu, Connor R. Duke, Benjamin A. Bard
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Patent number: 9069535Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: June 5, 2014Date of Patent: June 30, 2015Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 9046109Abstract: A centrifugal blower in a cooling system of an electronic device having asymmetrical blade spacing with acceptable balance. The asymmetrical blade spacing is determined according to a set of desired acoustic artifacts that are favorable and balance that is similar to that found with equal fan blade spacing. In one embodiment, the fan impeller can include sixty one fan blades.Type: GrantFiled: August 29, 2012Date of Patent: June 2, 2015Assignee: Apple Inc.Inventors: Connor R. Duke, Jesse T. Dybenko
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Patent number: 9046108Abstract: A centrifugal blower in a cooling system of an electronic device having asymmetrical blade spacing with acceptable balance. The asymmetrical blade spacing is determined according to a set of desired acoustic artifacts that are favorable and balance that is similar to that found with equal fan blade spacing. In one embodiment, the fan impeller can include thirty one fan blades.Type: GrantFiled: August 29, 2012Date of Patent: June 2, 2015Assignee: Apple Inc.Inventors: Connor R. Duke, Jesse T. Dybenko
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Patent number: 9039393Abstract: A centrifugal blower in a cooling system of an electronic device having asymmetrical blade spacing with acceptable balance. The asymmetrical blade spacing is determined according to a set of desired acoustic artifacts that are favorable and balance that is similar to that found with equal fan blade spacing. In one embodiment, the fan impeller can include thirty one fan blades. The perceived sound quality from the fan is improved with essentially no effect on the thermal performance of the fan.Type: GrantFiled: August 29, 2012Date of Patent: May 26, 2015Assignee: Apple Inc.Inventors: Connor R. Duke, Jesse T. Dybenko