Abstract: A double-sided backplane assembly is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card centrally located between a stiffener and an EMC shield affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.

Abstract: This circuit system accommodates the interconnection of a plurality of modules, each containing a plurality of semiconductor chips, by means of a flexible printed circuit wiring assembly containing contact pads and an interconnection wiring pattern. The modules contain a set of contact pads corresponding to the pads on the flexible wiring assembly and alignment pins to bring the abutting pads into registration. The pads on the flexible wiring assembly have a plurality of contact bumps to make better contact with the module packs. Clamping means is provided to retain the module and exert pressure on the contact pads.

Abstract: Interconnection between a large planar electronic printed circuit board and a plurality of relatively smaller electronic printed circuit cards is accomplished by connecting the planar board to an array board by means of elongated interposer connectors. The array board contains a plurality of positions which accommodate the plugging of electronic printed circuit cards and cables. A mechanical ejection system allows the planar board to be removed from the system without disturbing the cards, cables or the interposer connection to the array board.